Micro grid bridge structures

ABSTRACT

A micro grid bridge structure and an associated method of formation. The micro grid bridge structure includes micro grid apparatuses and at least one bridge module including two bridge units connected by a bridge hinge. Each micro grid apparatus includes a central area and radial arms defining docking bays. Each bridge unit in each bridge module is latched into a docking bay of a respective micro grid apparatus of two micro grid apparatuses to bridge the two grid apparatuses together such that each micro grid apparatus is bridged to at least one other micro grid apparatus. Each micro grid apparatus is either a power hub apparatus whose central area includes rechargeable batteries or a processor apparatus whose central area includes processors that includes a unique processor having a unique operating system differing from an operating system in each other processor.

This application is a continuation application claiming priority to Ser.No. 12/609,057, filed Oct. 30, 2009.

FIELD OF THE INVENTION

The present invention relates to a micro grid bridge structures and anassociated method of formation.

BACKGROUND OF THE INVENTION

The world is melting into a global internet village in which countriesand states are literally becoming super-suburbs. Computer communicationadvancements are primarily fuelling exploding events in this globalinternet village.

Unfortunately, current technology does not combine and utilize resourcesin a manner that enables adequate and efficient responses to problemsand challenges in this global internet village.

Thus, there is a need for an apparatus and method that combinesresources for enabling adequate and efficient responses to problems andchallenges relating to use of the Internet.

SUMMARY OF THE INVENTION

The present invention provides a micro grid bridge structure,comprising:

a plurality of micro grid apparatuses, each micro grid apparatuscomprising a central area and radial arms integrally connected to andextending radially outward from the central area such that each pair ofadjacent radial arms defines a docking bay into which into which anirregular shaped module may be latched;

at least one bridge module comprising two bridge units connected by abridge hinge;

each bridge unit in each bridge module of the at least one bridge modulebeing latched into a docking bay of a respective micro grid apparatus oftwo micro grid apparatuses of the plurality of micro grid apparatuses tobridge the two grid apparatuses together such that each micro gridapparatus is bridged to at least one other micro grid apparatus of theplurality of micro grid apparatuses;

each micro grid apparatus being either a power hub apparatus whosecentral area comprises a plurality of rechargeable batteries or aprocessor apparatus whose central area comprises a plurality ofprocessors that includes a unique processor having a unique operatingsystem differing from an operating system in each other processor of theplurality of processors.

The present invention provides a method for forming a micro grid bridgestructure, said method comprising:

providing a plurality of micro grid apparatuses and at least one bridgemodule comprising two bridge units connected by a bridge hinge, eachmicro grid apparatus comprising a central area and radial armsintegrally connected to and extending radially outward from the centralarea such that each pair of adjacent radial arms defines a docking bayinto which an irregular shaped module may be latched;

latching each bridge unit in each bridge module of the at least onebridge module into a docking bay of a respective micro grid apparatus oftwo grid micro apparatuses of the plurality of micro grid apparatuses tobridge the two grid apparatuses together, resulting in each micro gridapparatus being bridged to at least one other micro grid apparatus ofthe plurality of micro grid apparatuses,

each micro grid apparatus being either a power hub apparatus whosecentral area comprises a plurality of rechargeable batteries or aprocessor apparatus whose central area comprises a plurality ofprocessors that includes a unique processor having a unique operatingsystem differing from an operating system in each other processor of theplurality of processors.

The present invention advantageously provides an apparatus and methodthat combines resources for enabling adequate and efficient responses toproblems and challenges relating to use of the Internet.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a computer system comprising a micro gridapparatus and irregular shaped modules connected to the micro gridapparatus via respective connection interfaces, in accordance withembodiments of the present invention.

FIG. 2A is a diagram depicting the micro grid apparatus of FIG. 1, inaccordance with embodiments of the present invention.

FIG. 2B is a diagram showing an irregular shaped module, in accordancewith embodiments of the present invention.

FIG. 2C depicts a micro grid system stack, in accordance withembodiments of the present invention.

FIG. 3A depicts a micro grid apparatus, in accordance with embodimentsof the present invention.

FIG. 3B depicts a micro grid system stack, in accordance withembodiments of the present invention.

FIG. 4A depicts a micro grid system stack, in accordance withembodiments of the present invention.

FIG. 4B depicts a micro grid apparatus, in accordance with embodimentsof the present invention.

FIG. 4C is a flow chart describing a process for detecting an alert andfor responding to the detected alert, in accordance with embodiments ofthe present invention.

FIG. 4D is a flow chart describing a process for detecting an alert andfor responding to the detected alert, in accordance with embodiments ofthe present invention.

FIG. 4E is a flow chart describing a process for detecting an alert andfor responding to the detected alert, in accordance with embodiments ofthe present invention.

FIG. 5A depicts a micro grid system stack of 18 processors, inaccordance with embodiments of the present invention.

FIG. 5B depicts two micro grid system stacks, each stack comprising 18processors, in accordance with embodiments of the present invention.

FIG. 5C depicts three micro grid system stacks, each stack comprising 18processors, in accordance with embodiments of the present invention.

FIG. 5D is a diagram of a geographic area comprising the four macrogrids associated with the three micro grid system stacks of FIG. 5C, inaccordance with embodiments of the present invention.

FIG. 6A is a diagram of a geographic area comprising 5 macro grids and27 micro grid apparatuses, in accordance with embodiments of the presentinvention.

FIG. 6B is a diagram of a geographic area comprising 5 macro grids and12 micro grid apparatuses and being later in time than the geographicarea in FIG. 6A, in accordance with embodiments of the presentinvention.

FIG. 6C is a diagram of a geographic area comprising 5 macro grids and12 micro grid apparatuses and being later in time than the geographicarea in FIG. 6B, in accordance with embodiments of the presentinvention.

FIG. 6D is a diagram of a geographic area comprising 5 macro grids and12 micro grid apparatuses and being later in time than the geographicarea in FIG. 6C, in accordance with embodiments of the presentinvention.

FIG. 7A depicts a micro grid system stack of 18 processors, inaccordance with embodiments of the present invention.

FIG. 7B is a diagram showing a micro grid system stack of 18 processors,displaying an extension capability of buses, in accordance withembodiments of the present invention.

FIG. 7C is a diagram showing a micro grid system stack of 18 processors,displaying operating system change and re-assignment as artificialintelligence requirements of an apparatus are extinguished within asingle apparatus, in accordance with embodiments of the presentinvention.

FIG. 8 is a block diagram of a computer system, comprising a micro gridprocessor apparatus, irregular shaped modules connected to the microgrid processor apparatus via respective connection interfaces, and abridge module connecting to the micro grid apparatus to another microgrid apparatus, in accordance with embodiments of the present invention.

FIG. 9A is a diagram showing the bridge module of FIG. 8, in accordancewith embodiments of the present invention.

FIG. 9B is a diagram showing an internal structure of a bridge withinthe bridge module of FIGS. 8 and 9A, in accordance with embodiments ofthe present invention.

FIG. 10A is a diagram of an assembled micro grid apparatus, inaccordance with an embodiments of the present invention.

FIG. 10B depicts a vertical structure of a cross sectional view along aline A-B in FIG. 10A, in accordance with an embodiments of the presentinvention.

FIG. 11A depicts a micro grid bridge structure, in accordance withembodiments of the present invention.

FIG. 11B depicts a cross-sectional view along a line C-D in FIG. 11A, inaccordance with an embodiments of the present invention.

FIG. 11C is a diagram of a micro grid apparatus, in accordance with anembodiments of the present invention.

FIG. 12A is a diagram of a micro grid bridge structure, in accordancewith an embodiments of the present invention.

FIG. 12B is a diagram of a micro grid bridge structure, in accordancewith an embodiments of the present invention.

FIG. 13A is a diagram of a micro grid bridge structure having a complexmicro grid ring structure, in accordance with an embodiments of thepresent invention.

FIG. 13B is a diagram of a complex micro grid ring structure, inaccordance with an embodiments of the present invention.

FIG. 14A is a diagram of a micro grid bridge structure having a complexmicro grid mosaic structure, in accordance with an embodiments of thepresent invention.

FIG. 14B is a diagram of a complex micro grid mosaic structure, inaccordance with an embodiments of the present invention.

FIG. 15 is a block diagram depicting a micro grid computing system witha bridge module physically connecting a micro grid apparatus to a powerhub, in accordance with embodiments of the present invention.

FIG. 16A is a diagram of a micro grid bridge structure, showing a microgrid processor apparatus connected by a micro grid bridge module to amicro grid power hub, in accordance with embodiments of the presentinvention.

FIG. 16B is a diagram of a micro grid bridge structure, which is abridge structure showing a micro grid processor apparatus connected by afirst micro grid bridge module to a first micro grid power hub and by asecond micro grid bridge module to a second micro grid power hub, inaccordance with an embodiments of the present invention.

FIG. 16C is a vertical section diagram showing part of one micro gridprocessor apparatus connected by a micro grid bridge module to thebottom docking bay of part of a micro grid power hub, and two steps ofassembling irregular shaped modules into the remaining docking bayconnection points of a micro grid power hub structure, in accordancewith an embodiments of the present invention.

FIG. 16D is a vertical cross-sectional view along a line E-F depicted inFIG. 16B, showing the completed assembly process of this part of themicro grid apparatus, in accordance with an embodiments of the presentinvention.

FIG. 16E is a vertical section diagram showing part of one micro gridpower hub connected by a micro grid bridge module to the bottom dockingbay of part of another micro grid power hub, and two stages ofassembling irregular shaped modules, into the remaining docking bayconnection points of both micro grid power hubs, in accordance withembodiments of the present invention.

FIG. 16F is a vertical cross-sectional view along a line G-H depicted inFIG. 16B, showing the completed assembly process of this part of themicro grid apparatus, in accordance with an embodiments of the presentinvention.

FIG. 17 is a diagram showing the physical dimensional measurements ofthe complex micro grid apparatus and irregular shaped modules, inaccordance with embodiments of the present invention.

FIG. 18A is a diagram showing the physical characteristics of a microgrid Random Access Memory (RAM) irregular shaped module, according to anembodiment of the present invention.

FIG. 18B is a diagram showing the physical characteristics of a microgrid Input and Output (I/O) irregular shaped module, in accordance withembodiments of the present invention.

FIG. 18C is a diagram showing the physical characteristics of a microgrid 802.11s Mesh Wireless irregular shaped module, in accordance withembodiments of the present invention

FIG. 18D is a diagram showing the physical characteristics of a microgrid Global Positioning System (GPS) irregular shaped module, inaccordance with embodiments of the present invention.

FIG. 18E is a diagram showing the physical characteristics of a microgrid Communications irregular shaped module, in accordance withembodiments of the present invention.

FIG. 18F is a diagram showing the physical characteristics of a microgrid Failsafe Battery irregular shaped module, in accordance withembodiments of the present invention.

FIG. 18G is a diagram showing the physical characteristics of a NineCell processor micro grid add-on irregular shaped processor module, inaccordance with embodiments of the present invention.

FIG. 18H is a diagram showing the physical characteristics of anEighteen Cell Processor micro grid add-on irregular shaped module, inaccordance with embodiments of the present invention.

FIG. 19A is a diagram showing physical characteristics of a micro gridpower hub, in accordance with embodiments of the present invention.

FIG. 19B is a vertical cross-sectional view along a line I-J depicted inFIG. 19A, showing physical characteristics of a micro grid power hub, inaccordance with embodiments of the present invention.

FIG. 20 is a diagram showing electrical power and data bus distributionand characteristics of a micro grid power hub, in accordance withembodiments of the present invention.

FIG. 21A is a vertical section diagram showing a micro grid power hub asa single apparatus, in accordance with embodiments of the presentinvention.

FIG. 21B is a vertical section diagram showing a micro grid power huband bridge module connected to a micro grid processor ceramic chipapparatus as part of a larger apparatus, in accordance with embodimentsof the present invention.

FIG. 22A is a diagram showing physical characteristics of a circularshaped micro grid ‘solar power skin’ structure, according to anembodiment of the present invention.

FIG. 22B is a vertical cross-sectional view along a line L-M depicted inFIG. 22A, showing a micro grid power hub, and the assembly of a circularshaped micro grid ‘solar power skin’ structure, in accordance withembodiments of the present invention.

FIG. 22C is a vertical cross-sectional view along a line L-M depicted inFIG. 22A, showing a micro grid power hub assembled with a circularshaped micro grid ‘solar power skin’ structure, in accordance withembodiments of the present invention.

FIG. 23 is a diagram of a micro grid apparatus in which irregular shapedmodules are fitted into all available docking bays, in accordance withembodiments of the present invention.

FIG. 24 is a flow chart describing a process for assembling a micro gridapparatus, in accordance with embodiments of the present invention.

FIG. 25 is a flow describing a process for assembling a micro gridbridge structure, in accordance with embodiments of the presentinvention.

FIG. 26 illustrates an exemplary data processing apparatus used forimplementing any process or functionality of any processor, apparatus,or structure used in accordance with embodiments of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates generally to grid computing, and moreparticularly to micro grid and macro grid processing, the functionalsystem purpose, the system structure, and method of system use of thesame, that provides for the functionality of a micro grid, additionaldata buses necessary to interface to a micro grid and macro grid, andeach of the system elements' functional relationship with, wirelessmacro grid alerts under artificial intelligence control. Existingapplication software, operational system software, communicationssoftware, and other software including drivers, interpreters andcompilers for micro processor systems can function within embodiments ofthe present invention.

The detailed description of the invention is presented in the followingsections:

A. Micro Grids and Macro Grids;

B. Micro Grid Bridge Structures;

C. Micro Grid Power;

D. Data Processing Apparatus.

A. Micro Grids and Macro Grids

FIG. 1 is a block diagram of a computer system 50 comprising a microgrid apparatus 100 and irregular shaped modules 200, 410, 415, 420, and425 connected to the micro grid apparatus 100 via respective connectioninterfaces 55, in accordance with embodiments of the present invention.The micro grid apparatus 100 is also called a “complex shape”.

The micro grid apparatus 100 is configured to enable the irregularshaped modules 200, 410, 415, 420, and 425 to be geometrically connectedthereto via the respective connection interfaces 55. The connectioninterfaces 55 accommodate a V-shaped geometric connection between theirregular shaped modules 200, 410, 415, 420, and 425 and the complexshape of the micro grid apparatus 100.

The micro grid apparatus 100 comprises a central area 115 (see FIG. 2A)that includes a micro grid, wherein the micro grid comprises a pluralityof processors 65. In one embodiment, each processor of the plurality ofprocessors 65 has a unique Internet Protocol (IP) address. The referencenumeral “65” refers to the collection of processors that the pluralityof processors consists of. In embodiments of the present invention, theplurality of processors 65 consists of nine or eighteen individualprocessors. In practice, the number of processors may be determined bydesign criteria, manufacturing considerations, etc. In FIG. 2A, acentral area 115 of the micro grid apparatus 100 having a complex shapecomprises a plurality of processors 65 consisting of nine processorswith connection to a micro grid wireless module of irregular shape 415and four other types of add-on hardware interface modules of theirregular shaped modules 200, 410, 420, and 425 (see FIG. 1)accommodated in the five docking bays 450. The central area 115comprises a plurality of processors 65 that are linked togetherwirelessly or by direct electrical connection, and the plurality ofprocessors 65 are linked wirelessly or by direct electrical connectionto each irregular shaped module.

Each processor of the plurality of processors 65 has its own individualoperating system and assigned resources (e.g., cache memory—not shown).The operating system within each processor of the micro grid apparatus100 controls the programmatic housekeeping and individual processoravailability and assignment of the micro grid, including allocation ofrandom access memory of irregular shape 200 to the processors withcommon types of operating systems within the micro grid apparatus 100,and other communication interfaces of irregular shape 425. Theprocessors within the apparatus 100 are linked by multiple data buses(not shown) for data transfer and electrical connection to each otherwhere they collectively reside with their individual cache memory andcache controllers in the same physical apparatus. Contemporaneously,there are multiple operating systems actively functioning in thedifferent processors of the same physical micro grid apparatus 100.

An assembled micro grid apparatus structure of the present invention isconstructed from two physically different components: (1) the complexshape of the micro grid apparatus 100, which may embody the centralprocessing units cell wafer including the associated cache memory, thecache controllers, and the associated electronic circuits of the microgrid apparatus 100; and (2) the closely packed modular irregular shapedmodules (e.g., 200, 410, 415, 420, 425 for which there are five dockingbays provided) and/or bridge modules as discussed infra in conjunctionwith FIG. 8.

In FIG. 1, the five different irregular shaped modules, which may beselected and assembled for functional use by the micro grid apparatus100, include: (1) the irregular shape 200 which embodies random accessmemory (RAM); (2) the irregular shape 425 which embodies communicationscomprising Transmission Control Protocol/Internet Protocol (TCP/IP)Ethernet, cable, and/or fiber optic communications; (3) the irregularshape 420 which embodies a Global Positioning System (GPS); (4) theirregular shape 415 which embodies micro grid wireless connection points(e.g., 18×802.11s micro grid wireless connection points); and (5) theirregular shape 410 which embodies input and output (I/O) supportincluding data buffers for serial and parallel linked peripheralcomponents and devices.

The irregular shaped modules 200, 410, 415, 420, and 425 areinterchangeable and fit any docking bay in the micro grid apparatus 100as determined by system architectural design. Different combinations,including multiples of one type of irregular shape, are permitted in anassembled apparatus. For example, three RAM modules 200, a micro gridwireless module 415, and a global positioning module 420 wouldfacilitate a mobile micro grid apparatus 100 with a particularly largeamount of memory; however it would not have I/O, or physical connectablecommunication functionality. Each irregular module is coupled by highspeed bi-directional data buses available at the connection interface(e.g., ‘V’ shaped connection interface) 55. The total number of suchdata buses is equal to the total number of processors of the pluralityof processors. For example, if the total number of such processors is18, then the total number of such data buses is 18. The processors ofthe plurality of processors 65 contained in the complex shape of themicro grid apparatus 100 communicate individually via each of theavailable individual data buses (e.g., of 18 data buses) to theirregular shaped module 415, connected by the ‘V’ shaped connectioninterface 55.

The plurality of processors 65 includes a unique processor 60 having itsunique operating system and is included among the associated micro gridof processors 65, and may include associated internal cache memory andcache memory control, main random access memory 200 for storing data andinstructions while running application programs, a mass-data-storagedevice, such as a disk drive for more permanent storage of data andinstructions, peripheral components such as monitors, keyboard, pointingdevices, sensors and actuators which connect to the I/O module 410, dataand control buses for coupling the unique processor 60 and its operatingsystem to the micro grid processors and components of the computersystem, and a connection bus 55 for coupling the micro grid processorsand components of the computer system. FIG. 8, described infra, depictsan exemplary data processing apparatus in which any processor of thepresent invention may function.

The present invention utilizes one or more operating systems residing insingle processors, and multiple operating systems residing in multipleprocessors, such as may be embodied on the same wafer, can beconstructed with known software design tools and manufacturing methods.

The computer system 50 provides the following functionalities:

-   -   1. Containment of the micro grid apparatus 100 and its I/O        capability for detecting local alerts and peripheral device        interfacing with I/O module 410, its communications capability        for receiving alerts via communications module 425, its global        positioning system module 420 for detecting location and change        of location when mobile, its multiple wireless communications        ability for data interchange via the micro grid wireless module        415, and its system memory storage via RAM module 200, embodied        in a single apparatus incorporating a single complex shape, and        coupled to selectable and interchangeable modules of irregular        shape (e.g., module 415) is provided for.    -   2. Enablement to heat dissipation of the complex shape of the        micro grid apparatus 100 is provided for by two surfaces being        available without obstruction by connection pins. Thus in one        embodiment, no connection pins are connected to either or both        of a top surface and a bottom surfaces of the central area 115.        This physical method of forming the apparatus doubles the        available surface area for heat dissipation capability and        enhances known heat dissipation techniques for micro processors.        The underside connection pins of the complex shape may be        provided only on the radial arms to functionally facilitate dual        heat dissipation contact devices on the top and underside of the        complex shape. Thus in one embodiment, connection pins are        connected to a bottom surface of at least one radial arm of the        radial arms 110 and not to a top surface any radial arm 110. A        suitable hole in the mountable multi-layered printed circuit        board under the complex shape will accommodate the underside        heat dissipation device.    -   3. Enablement of modularity in micro computer structural design        of the computer system 50 is provided by selecting all or any        multiple combinations of available irregular shaped modules        (e.g., 200, 410, 415, 420, and/or 425) and other        ‘interconnecting modules’. The method of the present invention        forms a modular design with flexibility that provides for        generalized micro grid functionality, as well as specialized        micro grid functionality, and provides customized design        functionality for larger and more complex grid computing systems        constructed from a plurality of interconnected micro grids.    -   4. Enablement of scaleable designs of the micro grid apparatus        (by use and interconnection of multiple complex shapes) is        provided for grid computing.    -   5. Enablement of micro grid hardware design change and working        system reconfiguration of a micro grids functionality is        provided. Irregular shaped modules (e.g., 200, 410, 415, 420,        and/or 425) can be mechanically extracted from the complex shape        and other irregular shaped modules selected and mechanically        inserted in the resultant vacant docking bay as a design change        preference to alter the micro grid functional design. A change        of the irregular shaped modules 200, 410, 415, 420, and/or 425        provides for system software diversity by reconfiguration for a        micro grids functionality.    -   6. Enablement of robotic micro grid maintenance and remote        design change is provided. The irregular shaped modules are        designed for ease of extraction and replacement. This feature        enhances techniques for microprocessor maintenance by system        engineers and facilitates robotic intervention for hardware        fault elimination of irregular shaped modules in remote or        dangerous locations (e.g., spacecraft probes in hostile        atmospheres).    -   7. Enablement of dynamic change of the operating system software        functioning in each micro grid processor, by instruction from        the unique processor 60, to function within the embodiment of a        single apparatus as a macro grid processor with ifs assigned        micro grid processors, independently generated and wirelessly        connected. The macro grid processor connects wirelessly the        wireless module 415 to other adjacent macro grid processors        forming a macro grid across which a transient and mobile        artificial intelligence resides.

FIG. 2A is a diagram depicting the micro grid apparatus 100 of FIG. 1,in accordance with embodiments of the present invention. The micro gridapparatus 100 comprises a central area 115 and five radial arms 110,wherein the radial arms 110 are external to and integral with thecentral area 115. A micro grid apparatus generally comprises a pluralityof radial arms. For example, the number of radial arms may consist of 2,3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc. or at least 2, 3, 4, 5, 6, 7, 8,9, 10, 11, 12, etc. The central area 115 of the micro grid apparatus 100provides hardware containment of a basic micro grid of 9 processors 65each with its own operating system. The unique processor 60 has a uniqueoperating system that differs from the operating system of each of theother processors. The unique processor 60 governs all other processorsof the plurality of processors 65. The docking bays 450 are defined byadjacent radial arms 110 and accommodate irregular shaped modules suchas irregular shaped modules 200, 410, 415, 420, and/or 425 discussedsupra in conjunction with FIG. 1.

The processors are linked to each other via a system bus (not shown), amicro grid bus (not shown) and a macro grid bus (not shown). Knownexisting (and future designed) application software, operational systemsoftware, communications software, and other software including drivers,interpreters and compilers for micro processor systems may functionwithin the embodiments of the present invention. Any irregular shapedmodule is able to connect to any of the five docking bays available inthe complex ceramic chip structure in any combination, including thearrangement of five bridge modules attached to one complex ceramic chipstructure. In one embodiment, Terrestrial and 802.11g WirelessCommunication protocols and standards may be employed for use in thepresent invention. In one embodiment, the Mesh Wireless Communication802.11s standard may be employed for use in the present invention.Circumstances (e.g., manufacturing, research, etc.) determine standards(e.g., 802.11g, 802.11s, and other existing wireless standards andfuture standards) that may be used in different embodiments or indifferent combinations in the same embodiment (e.g., inclusion ofcommunication techniques such as ‘Bluetooth’).

In one embodiment, the outer curved edge 105 of the radial arm 110 isphysically manufactured to the shape of a circle, resulting in the outercurved edge 105 of the radial arms 110 being at a radial distance (e.g.,of 5 cm in this example) from a radial center 112 of the circle (i.e.,the circle has a diameter of 10 cm in this example) within the centralarea 115 of the micro grid apparatus 100. Each radial arm 110 extendsradially outward from the central area 115 and has an outer curved edge105 disposed at a constant radial distance from the radial center 112.Thus, the outer curved edges 105 of the radial arms 110 collectivelydefine a shape of a circle centered at the constant radial distance fromthe radial center 112. The circle has a diameter exceeding a maximumlinear dimension of the central area 115. Each pair of adjacent radialarms 110 defines at least one docking bay 450 into which an irregularshaped module can be inserted. The total number of docking bays 450 isequal to the total number of radial arms 110. In one embodiment, one ormore irregular shaped modules are inserted into respective docking bays450 defined by adjacent radial arms 110. In one embodiment, the radialarms 110 are uniformly distributed in azimuthal angle φ about the radialcenter 112. In one embodiment, the radial arms 110 are non-uniformlydistributed in azimuthal angle φ about the radial center 112, which maybe employed to accommodate different sized irregular shaped modules withcorresponding radial arms 110 that present different sizes and shapes oftheir ‘V’ interface.

The central area 115 of the micro grid apparatus 100 comprises aplurality of processors 65 that are electrically linked together and areelectrically linked to each irregular shaped module that is insertedinto a respective docking bay 450 defined by adjacent radial arms 110.The central area 115 has a polygonal shape (i.e., a shape of a polygon113) whose number of sides is twice the number of radial arms 110. Thedashed lines of the polygon 113 do not represent physical structure butare shown to clarify the polygonal shape of the polygon 113. In FIG. 2A,the polygon 113 has 10 sides which corresponds to the 5 radial arms 110.The polygon of the polygonal shape of the micro grid apparatus 100 maybe a regular polygon (i.e., the sides of the polygon have the samelength and the internal angles of the polygon are equal to each other)or an irregular polygon (i.e., not a regular polygon). The radial arms110 may be uniformly distributed in azimuthal angle φ about the radialcenter 112. The radial arms 110 being uniformly distributed in azimuthalangle φ about the radial center 112 is a necessary but not sufficientcondition for the polygon of the polygonal shape of the micro gridapparatus 100 to be a regular polygon. Accordingly, the radial arms 110may be uniformly distributed in azimuthal angle φ about the radialcenter 112 such that the polygon is not a regular polygon. In oneembodiment, the radial arms 110 are non-uniformly distributed inazimuthal angle φ about the radial center 112.

The central area 115 is structurally devoid of connection pins on thetop and underside surfaces, enabling direct contact with heatdissipation devices on both surfaces. The radial arms 110 haveconnection pins on the underside (i.e., bottom) surface.

Five docking bays 450 for the irregular shaped modules (200, 410, 415,420, 425) are provided between the radial arms 110. Each radial arm 110has parallel sides 111 oriented in a radial direction and are 1.4 cmwide in this example. The arc at the outer curved edge 105 of the radialarm 110 has a chord of 2.7 cm in this example.

The connection interface 55 provides an electrical connection ‘V’ pointfor a system bus between the complex structure and the irregular shapedmodules and is available along the edge of the docking bay 450 of thepentagonal shape of the central area 115 of the complex shape. The buscomprises individual bi-directional data buses (e.g., 18 data buses)capable of connecting the micro grid processors (e.g., 18 processors)with their own operating systems to their own individual wirelessdevices contained in the irregular shaped module 415 for micro gridwireless connection points. The mechanical connection is achieved by theirregular shaped module 415 press fitting its wedged connection pointedge into a ‘V’ edged protrusion along the length of the complex shape;i.e., the docking bay's pentagonal edge.

FIG. 2B is a diagram showing an irregular shaped module 415, inaccordance with embodiments of the present invention. The irregularshaped module 415 in FIG. 2B may alternatively be any other irregularshaped module such as the irregular shaped module 200, 410, 420, or 425.The irregular shaped module in FIG. 2B contains chip structure toprovide hardware containment of the micro grid wireless interfaces andis ensconced in place with downward pressure on the curved edge 205within the embrace of the docking bay after their electrical connection‘V’ shaped receptacle edge has been positioned correctly and is incontact with the electrical connections of the complex shape's ‘V’protrusion edge. The curved edge 205 in FIG. 2B is analogous to thecurved edge 105 in FIG. 2A.

The latching mechanism on the radial arms 110 of the complex shape inFIG. 2A is provided as a raised and rounded protrusion of about 1.5 mmheight×about 3.5 mm length along the edge 320 of both sides of theirregular module shape 415 in this example. This protrusion fits areceptacle with the same characteristics to receive the complex shape,on all the radial arm edges of the complex shape. In one embodiment, theirregular shaped modules are manufactured from a slightly softer moldedmaterial to provide the mechanical contraction against the harderceramic form of the complex shaped module, thus enabling the latchingmechanism to work. In one embodiment, the manufacturing is configured tocreate a relatively softer complex shaped module to accept relativelyharder irregular shaped modules.

The irregular shapes are manufactured to fit perfectly within thedocking bay 450 (see FIG. 2A), with less than 0.1 mm of gap tolerancearound the non contact edges in this example. The gap tolerance (0.1 mmor otherwise) is determined by the mechanics of the protrusion andreceptacle mechanical latching mechanism described supra. The chord ofthe curved edge 205 is 3.5 cm and the non-contact side 210 of theirregular shaped module is 2.2 cm in length in this example. Connectionpins are not present on the irregular shaped module, and similar to thecomplex shape, both top surfaces 215 and underside surfaces areavailable for contact with heat dissipation devices. External systemdevices such as a disk drive (not shown) for more permanent storage ofdata and instructions, and peripheral components such as monitors,keyboard, pointing devices, sensors and actuators, connect via theunderside pins on the radial arms of the complex shape to the I/Oirregular shaped module 410.

Similarly, the global positioning irregular shaped module 420 and thecommunications irregular shaped module 425 connect to their externalassociated hardware (i.e., physical antenna, cable and fiberconnections) via the underside pins on the radial arms of the complexshape. The RAM irregular shaped module 200) and micro grid wirelessmodule 415 do not necessarily require the use of connection pins underthe complex shape as they are self contained and do not have anyassociated external hardware.

In accordance with the present invention, each individual processor canparticipate as a member of the micro grid apparatus 100 and may beconscripted for functional use from within the micro grid apparatus 100by one uniquely assigned processor (e.g., by processor 60) with itsindividual operating system. Each processor of the plurality ofprocessors 65 has its own individual operating system and assignedresources (e.g., cache memory—not shown) and is available to participateeither by direct connection and/or wirelessly (802.11g), eitherindividually and/or collectively, on demand, from within the embodimentof the micro grid apparatus 100 to an external dynamically expanding andcontracting wireless macro grid, comprised of conscripted andparticipating processors, from a plurality of participating micro gridsaccording to embodiments of the present invention. Each processor ofcommon processors within the micro grid apparatus 100 with the same typeof individual operating system and assigned resources is available forfunctional use as a wirelessly connected participant of one or moremacro grids.

A macro grid comprises a set of processors conscripted from one or moremicro grid apparatuses to become macro grid processors within the macrogrid. A macro grid may also include other computational resources whichdo not function as a macro grid processors, such as other micro gridprocessors of the one or more micro grid apparatuses.

A macro grid may dynamically change as a function of time. The macrogrid has a geographical footprint, which is spatial contour defined bythe macro grid processors in a macro grid. The spatial contour of thegeographical footprint may be generated by fitting a curve to thegeographical locations of the macro grid processors in a macro grid at agiven instant of time. The geographical footprint (i.e., the spatialcontour) of a macro grid expands or contracts dynamically as macro gridprocessors are added or removed, respectively, from the macro grid andalso as the spatial location of one or more macro grid processors in themacro grid change as a function of time.

Conscripted micro grid processors that are participants in a macro gridcould be physically contained within the confines of a moving vehicle, aflying airplane, a sailing ship, a walking person, etc. Thus, themobility of macro grid processors contributes to dynamic changes in themacro grid.

An artificial intelligence of the present invention is intelligentsoftware implemented by a macro grid (i.e., by the macro grid processorsin a macro grid) to perform a task or a set of tasks in real time inresponse to detection of an alert pertaining to an event. The alert maybe detected by a unique processor 60 residing in the plurality ofprocessors in the complex shape of the micro grid apparatus 100. In oneembodiment, the artificial intelligence (i.e., the intelligent software)of a macro grid is located in a single macro grid processor of the macrogrid. In one embodiment, the artificial intelligence is distributedamong a plurality of macro grid processors of the macro grid (i.e.,different portions of the software comprised by the artificialintelligence are stored in different macro grid processors of the macrogrid). In one embodiment, the artificial intelligence is distributed andstored among all of the macro grid processors of the macro grid. Thelocation of the artificial intelligence in the macro grid may be static(i.e., unchanging) or may dynamically change in accordance with atransient evolution of the macro grid as the response to the alertdevelops over time and eventually reduces and terminates as the specificevent associated with the alert diminishes and is quenched. In addition,the mobility macro grid processors of a macro grid may be accompanied bylocational changes in the artificial intelligence associated with themacro grid.

The scope of logic, decision making, and any other intelligentfunctionality in an artificial intelligence of the present inventionincludes the current state of knowledge, and enablement of thatknowledge for practical utilization, known to a person of ordinary skillin the field of artificial intelligence at any time that the presentinvention is practiced. Thus, it is contemplated that an artificialintelligence of the present invention will be utilized with increasingcapabilities and levels of sophistication as corresponding capabilitiesand levels of sophistication are developed in the field of artificialintelligence.

An artificial intelligence is created by hardware and/or software in anymanner known to a person of ordinary skill in the field of artificialintelligence. For example, a set of artificial intelligences maypre-exist in a storage medium and a particular stored artificialintelligence that is capable of responding to the event associated withthe alert may be activated for use by the macro grid. As anotherexample, an artificial intelligence may generated by software in amanner that tailors the artificial intelligence to the specific eventassociated with the alert.

The unique processor 60 is used to create and dynamically change macrogrids and to generate artificial intelligences to govern (i.e., controland manage) operation of the macro grids in response to a real timealert. A software conscription request may be received (or generated) bythe unique assigned processor 60 in the micro grid apparatus 100 from(or to) uniquely assigned processors of other micro grids, that arewirelessly adjacent and available, to the alert sensing (or alerttransmitting) micro grid apparatus 100. In one embodiment, once an alertis acknowledged by the unique processors in two or more micro grids, amacro grid is formed and expands by further conscription demand of otheradjacent wirelessly available micro grids to become a large macro grid,comprised of a plurality of selected numbers of individual processorswithin a plurality of wirelessly connected micro grids. The macro gridprocessor connects wirelessly the wireless module 415 to other adjacentmacro grid processors forming a macro grid across which a transient andmobile artificial intelligence resides. The dynamically constructedmacro grid continues to function wirelessly utilizing changingpopulations of connected individual processors embodied within microgrids. The macro grid is governed by an artificial intelligence.

The macro grids expand and contract their geographic footprint as: (1)participating micro grid processor numbers increase and decrease; (2)the operating system of the micro grid unique processors re-prioritizesindividual processor availability; (3) the physical location of theparticipating processors change as detected via the global positioninginterface module 420; (3) the unique application program alert demand,from within the macro grid, adjusts requirements for micro gridprocessor participation; and/or (4) new alerts are raised for functionaluse of micro grid processors that are already engaged in functional useby other macro grids. It is noted that different macro grids can usedifferent processors embodied within the same micro grid apparatus.

An artificial intelligence is generated by the unique processor 60,within the wireless configuration of a macro grid, as a result of aprogram alert to the operating system of the unique processor 60 withinthe micro grid apparatus 100, from sensor signals and software activityon the I/O interface of irregular shaped module 410. In response to thealert, the artificial intelligence conscripts available physicallyconnected processors from within the described micro grid apparatus, andwirelessly conscripts available processors from different micro gridapparatus's within a prescribed or otherwise detectable range. Theartificial intelligence becomes transient and not specifically relianton the initiating host unique processor's operating system.

The artificial intelligence governs its macro grid via the operatingsystems of the unique processors of the participating, wirelesslyconnected micro grid apparatuses, and authoritatively controls thefunctionality and sustained vitality of its mobile macro grid that hasbeen initiated for it to reside upon, until expiry or offload. In oneembodiment, one macro grid supports one artificial intelligence, and onemicro grid may have mutually exclusive individual processors under thecontrol of multiple artificial intelligences.

A plurality of transient artificial intelligences can co-exist (eachcontained within their individual expanding and contracting macro-grids)contemporaneously. The different artificial intelligences utilizedifferent individual wirelessly connected micro grid processors, theircommon type operating systems, and their assigned resources, availablewithin any single micro grid apparatus.

FIG. 2C depicts a micro grid system stack 1250, in accordance withembodiments of the present invention. The micro grid system stack 1250is formed of 9 processors, two standard system data buses (1210, 1215),a micro grid system bus 1205, and a macro grid system bus 1220, toprovide data transfer pathways of the micro grid system stack towireless interfaces, I/O and other software connections of the assembledapparatus. The micro grid system stack 1250 is an example of a microgrid system stack generally. A micro grid system stack is comprised by amicro grid apparatus such as the micro grid apparatus 100 of FIG. 1 orFIG. 2A.

Various activities (e.g., research, manufacturing, etc.) may determinethe specific structure of these two standard system data buses (1210,1215). These standard system data buses (1210, 1215) could be usedindividually (e.g., one standard system data bus for inbound data, onestandard system data bus for outbound data), as a bidirectional addressbus, as a bidirectional data bus, or as a high speed ‘on wafer’extendable address/data ring similar to token ring and other microprocessor connection technologies. Thus, the present invention includesmultiple design options in bus structure and interconnections and alsoincludes both parallel and serial methods of data transfer.

The standard system bus (1210, 1215) provides for address and datainterchange between the unique system processor 60 and all of the microgrid processors individually. Conscription of a micro grid processor toparticipate as a macro grid processor, including instruction to a microgrid processor to change its operating system, occurs over this standardsystem bus (1210, 1215). Micro grid processor status and availability,monitoring of micro grid processor utilization, and micro grid processorprioritization also occurs over this standard system bus (1210, 1215) bythe unique processor 60. This standard system bus (1210, 1215) maintainsthe vitality of the micro grid and its resources.

The standard system bus (1210, 1215) also interconnects all of microgrid processors 65 to the RAM module 200, via memory control and cachememory control.

The standard system bus (1210, 1215) also interconnects the uniqueprocessor 60 to the I/O module 410 for detecting local attached alertsand interfacing with standard external peripheral system devices such asa disk drive for more permanent storage of data and instructions, andperipheral components such as monitors, keyboard, pointing devices,attached alert sensors and actuators.

The standard system bus (1210, 1215), also interconnects the uniqueprocessor 60 to the GPS module 420 for provision of location informationand movement.

The standard system bus (1210, 1215) also interconnects the uniqueprocessor 60 to the communications module 425 for receiving wirelessalerts from adjacent processors (but yet to be connected as macro gridprocessors) and cable communicated alerts from fiber optic and Ethernetconnected sensors. The communications module 425 is also utilized by themacro grid processors for responding to alerts by instructing actuatorsto counter the event. The micro grid system bus 1205 provides for datainterchange among any two (or groups) of the micro grid processors whenassigned by the unique processor 60, to provide additional processingcapacity to a macro grid processor. Once the micro grid participatingprocessors are identified and assigned, and are acting as an activecollaborating micro grid, the micro grid participating processors reducetheir individual use of the standard system bus (1210, 1215) and utilizethe micro grid system bus (1205). The present invention reduces datatraffic volumes on the standard system bus (1210, 1215) and providesalternate micro grid address and data capacity via the micro grid systembus (1205) and further provides macro grid address and data capacity viathe macro grid system bus (1220).

The macro grid system bus 1220 provides for data interchange from eachprocessor of the macro grid processors individually via the wirelessmodule 415 to other adjacent macro grid processors embodied within amacro grid. The artificial intelligence associated with the macro gridprocessor within the macro grid communicates to all the other macro gridprocessors within the macro grid.

The two standard system data bus (1210, 1215), the micro grid system bus1205 and the macro grid system bus 1220, are all available as a systembus 55 at the five connection points of the complex shape with theindividual irregular shaped modules. The system bus 55 serves as anembodiment of connection interface 55 (see FIG. 1).

The system bus 55 can be extended beyond the embodiment of one apparatusvia a bridge module (i.e., a bi-polygonal irregular shaped module).

FIG. 3A depicts a micro grid apparatus 1300, in accordance withembodiments of the present invention. The micro grid apparatus 1300,which may in one embodiment comprise a complex ceramic chip apparatus,is for containment of a micro grid of 18 processors 65. The processors65 each have its own operating system and operate under control of aunique processor 60 and its operating system, and are linked to eachother via the system bus (1210, 1215), the micro grid bus 1205, and themacro grid bus 1220 (see FIG. 2B). The micro grid apparatus 1300 isanalogous to the micro grid apparatus 100 of FIG. 2A.

FIG. 3B depicts a micro grid system stack 1350 of 18 processors 65, inaccordance with embodiments of the present invention. The micro gridsystem stack 1350 comprises two standard system data buses (1210, 1215),a micro grid system bus 1205, and a macro grid system bus 1220 toprovide data transfer pathways of the micro grid system stack towireless interfaces, I/O and other necessary software connections of theassembled apparatus. The unique processor 60 with its own uniqueoperating system resides at the first position in the micro grid stackof processors 65. The two groups of cell processors 65 are collectivelyembodied in the stack as a continuous row of available micro gridprocessors for determination of use, by the unique processor 60.

FIG. 4A depicts a micro grid system stack 1400 of 18 processors 65, inaccordance with embodiments of the present invention. The 18 processors65 comprise a unique micro grid processor 60, a macro grid processor1405 for a single artificial intelligence to interface, 16 micro gridprocessors 65, and micro grid system buses for data transfer andsoftware connections, which include two standard system data buses(1210, 1215), a micro grid system bus 1205, and a macro grid system bus1220.

An alert to the unique processor 60 may be detected via the I/O module410 for the local and physically connected sensors to the apparatus; orvia the communications module 425 receiving the alert wirelessly forremote sensors linked to the apparatus.

An external macro grid alert to the unique processor 60 (e.g., asreceived from the communication module 425's wireless connection to anadjacent macro grid processor) may contain an externally computed valueof scale (S), wherein S is a function of a magnitude of the event (E),an urgency level for responding to the event (U), and a quash time forextinguishing the event (Q). The magnitude of the event (E) thattriggered the alert is a numerical value within a predefined range ofnumerical values (e.g., a continuous range of values such as 1 to 10, adiscrete set of values such as the integers 1, 2, 3, . . . , 10, etc.).The urgency level (U) for responding to the event is a numerical valuewithin a predefined range of numerical values (e.g., a continuous rangeof values such as 1 to 10, a discrete set of values such as the integers1, 2, 3, . . . , 10, etc.). The quash time (Q) for extinguishing theevent is in units of seconds, minutes, hours, days, etc. In oneembodiment, the magnitude of an event (E) is derived from GPS datareceived by the artificial intelligence from GPS modules (420) attachedto participating micro grid apparatuses across the extremity of thegeographical footprint of the macro grid. In one embodiment, the urgencylevel (U) is derived from the TCP/IP sensors alert signal frequency(e.g., one alert signal per second, one alert signal per millisecond,etc.). In one embodiment, S=(E×U)/Q. In one embodiment, E and U areindependent of each other. In one embodiment, U is a function of E. Forexample, if U is a linear function of E, then S is proportional to T²/Q.

The unique processor 60 assigns an internal micro grid processor tomodify its operating system and becomes a macro grid processor of amacro grid, after which an artificial intelligence is generated for themacro grid. The macro grid processor created by the unique processor 60interrogates the alert and determines the number of available micro gridprocessors 65 (e.g., from information provided by the unique processorin the micro grid stack) to be assigned for countering the event byeither: (1) determining the scale of the event to be the scale (S)contained in the alert; or (2) determining the scale of the event bycomputing a value for the scale (S′) of the response necessary tocounter the event raised by an alert. The scale (S′) is computed by anartificial intelligence of the macro grid; e.g., by using the sameformula (e.g., S′=(T×U)/Q in one embodiment) as used for previouslycomputing the scale S received by the unique processor 60 in the alert,but may differ in value from S due to U and/or Q being different forcomputing S′ than for computing S (e.g., due to a change in U and/or Qhaving occurred from when S was computed to when S′ is computed). In oneembodiment, the number of available micro grid processors 65 to beassigned for countering the event is a non-decreasing function of thescale (S or S′) of the event.

The artificial intelligence in the macro grid processor then requestsother adjacent and wirelessly connectable unique processors to assign amicro grid processor to become a macro grid processor in a similar way.Accordingly, the macro grid begins to grow in footprint size and shape.

The scale (S) of the alert received by the unique processor 60 from anadjacent processor via the communication module's wireless may bepredetermined by an artificial intelligence in the adjacent processorrequesting assignment of a macro grid processor (including micro gridprocessing resources) from the unique processor 60.

FIG. 4B depicts a micro grid apparatus 500, in accordance withembodiments of the present invention. The micro apparatus 500 containsof the hardware and software of a micro grid system stack in the complexshape of the micro grid apparatus 500. The micro grid apparatus 500comprises the micro grid's system RAM 200, the micro grid's systemcommunication 425, the micro grid's system GPS 420, the micro grid'ssystem artificial intelligence wireless 415, and the micro grid's systemI/O 410.

FIG. 4C is a flow chart describing a process for detecting an alert andfor responding to the detected alert, in accordance with embodiments ofthe present invention. The flowchart of FIG. 4C comprises steps1431-1437.

In step 1431, the unique processor 60 constantly monitors the system bus(1210, 1215) for an ‘alert data packet’: (1) from any sensor directlyconnected to the I/O irregular shaped module 410 or to thecommunications module 425; or (2) from any external micro grid apparatusor any macro grid that is connected wirelessly or by direct electricalconnection to the micro grid apparatus 100. An alert data packetcomprises an alert pertaining to an event.

The ‘alert data packet’ may contain a computed value of scale (asdefined supra) to assist in determining the number of micro gridresources required to assist with countering the event from the locationof the external micro grid apparatus. GPS information from the GPSmodule 420 may be constantly interrogated to determine a ‘locationvalue’ for advising the artificial intelligence (generated in step 1435)as to where the event is, and as a consequence, influencing the macrogrid operating system to increase or decrease the number of micro gridprocessing resources participating from within the single apparatus.

Step 1432 determines whether the unique processor 60 has detected a datapacket comprising the alert in step 1431. If step 1433 determines thatthe unique processor 60 has detected a data packet comprising the alert,then step 1433 is next performed; otherwise the process loops back tostep 1431 to monitor for an alert.

In step 1433, via the micro grid bus 1205, the unique processor 60initiates a response to the alert by identifying an available micro gridprocessor within the micro grid apparatus comprising the uniqueprocessor 60, designates the available micro grid processor to be adesignated macro grid processor by altering the operating system of theavailable micro grid processor to a macro grid operating system, andassigns to the designated macro grid processor an alert ownership of amacro grid with an associated responsibility for the operation of themacro grid.

The designated macro grid processor assigns one or more additionalprocessors from the micro grid apparatus comprising the unique processor60 as micro grid computational resources are required by the macro grid.The total number of the one or more additional processors assigned ascomputational resources for the micro grid is a function of the scale ofthe alert. The macro grid operating system comprises softwareconfigured, upon being implemented (i.e., performed), to respond to theevent associated with the detected alert.

In one embodiment, step 1434 is performed if warranted by the nature ofthe event and/or scale of the alert. In step 1434, the designated macrogrid processor communicates the ‘alert data packet’ to the unique microgrid processor(s) in one or more different micro grid apparatuses, viathe wireless irregular shaped module 415 for connection. The uniquemicro grid processor in each micro grid apparatus of the one or moredifferent micro grid apparatuses assigns a micro grid processor in itsmicro grid apparatus to become an additional macro grid processor of themacro grid. The assembled macro grid communicates via the wirelesslyconnected macro grid system bus 1220. Each macro grid processor of thedesignated macro grid processors may assign one or more additionalprocessors from its micro grid apparatus as computational resources forthe macro grid. In one embodiment, the initially designated macro gridprocessor directs and oversees the operation of all of the other macrogrid processors of the macro grid.

In one embodiment, step 1434 is not performed and the macro gridconsequently has exactly one macro grid processor, namely the designatedmacro grid processor.

In step 1435, an artificial intelligence is generated for the macro gridby the designated macro grid processor. In one embodiment, theartificial intelligence is stored only in one macro grid processor(e.g., the designated macro grid processor) of the macro grid. In oneembodiment, a different portion of the artificial intelligence is storedin some but not all macro grid processors of the macro grid. In oneembodiment, a different portion of the artificial intelligence is storedin each macro grid processor of the macro grid.

The macro grid may dynamically expand or contract as the event increasesor decreases, respectively. If the alert is of a predefined scale (asdefined supra) requiring additional computational resources, or if amatched alert is detected in other micro grid apparatus(s) than themicro grid apparatus that detected the alert in step 1432, then microgrid processors within the other apparatus(s) are assigned to theartificial intelligence as computational resources. A ‘matched alert’ isdefined as an alert that communicates an enhancement of the eventassociated with the original alert detected in step 1432. As the eventdiminishes, macro grid processors and/or micro grid processors assignedas computational resources are removed from the macro grid.

In step 1436, the event associated with the alert is responded to andquenched by the artificial intelligence. The manner in which the macrogrid responds to and quenches the event is specific to the alert, asillustrated in three hypothetical examples which are described infra.

As the scale of the alert (as defined supra) is reduced such that fewercomputational resources are needed to combat the event associated withthe alert. Accordingly, the artificial intelligence returns no longerneeded macro grid processors back to associated micro grid processorsunder the control of the unique processor of the micro grid apparatusthat comprises each associated micro grid processor.

If a previously occurring matched alert disappears, then the artificialintelligence will commence returning the conscripted additional macrogrid processors back to the control of the corresponding uniqueprocessor in the micro grid apparatus that is wirelessly connected themicro grid apparatus 100. Eventually the designated macro grid processoritself is returned as a micro grid processor to the micro grid apparatus100, resulting in the artificial intelligence vacating the macro gridand the macro grid disappearing, thus extinguishing the macro grid andall of its included macro processors, along with the artificialintelligence, in step 1437.

FIG. 4D is a flow chart describing a process for detecting and forresponding to the detected alert, in accordance with embodiments of thepresent invention. The flow chart of FIG. 4D comprises steps 1451-1456.

In step 1451, the unique processor 60 constantly monitors the system bus(1210, 1215), via the communications module 425 of the micro gridapparatus 100, for an ‘alert data packet’: (1) from any sensor directlyconnected to the I/O irregular shaped module 410 or to thecommunications module 425; or (2) from any external micro grid apparatusor any macro grid that is connected wirelessly or by direct electricalconnection to the micro grid apparatus 100. An alert data packetcomprises an alert pertaining to an event.

The ‘alert data packet’ may contain a computed value of scale (asdefined supra) to assist in determining the number of micro gridresources required to assist with countering the event from the locationof the external micro grid apparatus. GPS information from the GPSmodule 420 may be constantly interrogated to determine a ‘locationvalue’ for advising the artificial intelligence (generated in step 1454)as to where the event is, and as a consequence, influencing the macrogrid operating system to increase or decrease the number of micro gridprocessing resources participating from within the single apparatus.

Step 1452 determines whether the unique processor 60 has detected a datapacket comprising the alert in step 1451. If step 1452 determines thatthe unique processor 60 has detected a data packet comprising the alertthen step 1453 is next performed; otherwise the process loops back tostep 1451.

In step 1453, via the micro grid bus 1205, the unique processor 60initiates a response to the alert by identifying an available micro gridprocessor within the micro grid apparatus comprising the uniqueprocessor 60, designates the available micro grid processor as a macrogrid processor by altering the operating system of the available microgrid processor to a macro grid operating system, and assigns to thedesignated macro grid processor an alert ownership of a macro grid withan associated responsibility for the operation of the macro grid.

In step 1454, an artificial intelligence is generated for the macrogrid, under control of the unique processor 60, and is stored in thedesignated macro grid processor. The artificial intelligence stored inthe designated macro grid processor, upon being implemented, may assignone or more additional processors from its micro grid apparatus ascomputational resources are for the macro grid.

In one embodiment, the artificial intelligence stored in the designatedmacro grid processor may trigger generation of other macro gridprocessors if warranted by the nature of the event and/or scale of thealert. Specifically, the artificial intelligence stored in thedesignated macro grid communicates with the unique micro grid processorin one or more different micro grid apparatuses to direct the uniquemicro grid processor in each micro grid apparatus of the one or moredifferent micro grid apparatuses to assign a micro grid processor in itsmicro grid apparatus to become an additional macro grid processor of themacro grid. In one embodiment, the artificial intelligence stored in thedesignated macro grid processor may affirm or negate the choice of theadditional macro grid processor by the unique micro grid processor ineach micro grid apparatus.

In one embodiment, the artificial intelligence does not triggergeneration of other macro grid processors and the macro gridconsequently has exactly one macro grid processor, namely the designatedmacro grid processor.

If generation of other macro grid processors is triggered, theartificial intelligence stored in the designated macro grid processormay generate, or trigger the generating of, other artificialintelligences to generate or develop a resultant artificialintelligence. In one embodiment, the artificial intelligence is storedonly in one macro grid processor (e.g., the designated macro gridprocessor) of the macro grid. In one embodiment, a different portion ofthe artificial intelligence is stored in some but not all macro gridprocessors of the macro grid. In one embodiment, a different portion ofthe artificial intelligence is stored in each macro grid processor ofthe macro grid.

If the alert is of a predefined scale (as defined supra) requiringadditional computational resources, or if a matched alert (as definedsupra) is detected in other micro grid apparatus(s) than the micro gridapparatus that detected the alert in step 1452, then micro gridprocessors within the other apparatus(s) are assigned to the artificialintelligence as computational resources.

In step 1455, the event is responded to by the artificial intelligence.The manner in which the macro grid and artificial intelligence respondsto and quenches the event is specific to the alert, as illustrated inthree hypothetical examples which are described infra.

As the scale of the alert (as defined supra) is reduced such that fewercomputational resources are needed to combat the event associated withthe alert. Accordingly, the artificial intelligence returns no longerneeded macro grid processors back to associated micro grid processorsunder the control of the unique processor of the micro grid apparatusthat comprises each associated micro grid processor.

If a previously occurring matched alert disappears, then the artificialintelligence will commence returning the conscripted additional macrogrid processors back to the control of the corresponding uniqueprocessor in the micro grid apparatus that is wirelessly connected themicro grid apparatus 100. Eventually the designated macro grid processoritself is returned as a micro grid processor to the micro grid apparatus100, resulting in the artificial intelligence vacating the macro gridand the macro grid disappearing, thus extinguishing the macro grid andall of its included macro processors, along with the artificialintelligence, in step 1456.

FIG. 4E is a flow chart describing a process for detecting an alert andfor responding to the detected alert, in accordance with embodiments ofthe present invention. The flow chart of FIG. 4E comprises steps1471-1477.

In step 1471, the unique processor 60 constantly monitors the system bus(1210, 1215), via the communications module 425 of the micro gridapparatus 100, for an ‘alert data packet’: (1) from any sensor directlyconnected to the I/O irregular shaped module 410 or to thecommunications module 425; or (2) from any external micro grid apparatusor any macro grid that is connected wirelessly or by direct electricalconnection to the micro grid apparatus 100. An alert data packetcomprises an alert pertaining to an event.

The ‘alert data packet’ may contain a computed value of scale (asdefined supra) to assist in determining the number of micro gridresources required to assist with countering the event from the locationof the external micro grid apparatus. GPS information from the GPSmodule 420 may be constantly interrogated to determine a ‘locationvalue’ for advising the artificial intelligence (generated in step 1475)as to where the event is, and as a consequence, influencing the macrogrid operating system to increase or decrease the number of micro gridprocessing resources participating from within the single apparatus.

Step 1472 determines whether the unique processor 60 has detected a datapacket comprising the alert in step 1471. If step 1472 determines thatthe unique processor 60 has detected a data packet comprising the alertthen step 1473 is next performed; otherwise the process loops back tostep 1471.

In step 1473, after detecting the alert data packet in step 1472, eachunique processor selects at least one processor from each micro gridapparatus.

In step 1474, each selected processor is designated as a macro gridprocessor of a respective macro grid by altering an operating system ofeach selected processor to a macro grid operating system and byassigning to each selected processor a responsibility for operation ofits respective macro grid.

In step 1475, an artificial intelligence is generated for each macrogrid.

In step 1476, the event is responded to and quenched by executing theartificial intelligence of each macro grid.

In step 1477 after the event has been quenched, the macro grids areextinguished.

In one embodiment, at least one micro grid apparatus comprises aplurality of micro grid apparatuses, wherein step 1474 results in therespective macro grids comprising a plurality of macro grids, andwherein executing the artificial intelligence of each macro grid in step1476 comprises contemporaneously executing the artificial intelligenceof each macro grid to perform said responding to and quenching theevent.

In one embodiment for each macro grid, one or more processors in eachmicro grid apparatus, other than the selected processors in each microgrid apparatus, are assigned as computational resources for each macrogrid.

In one embodiment, at least two macro grids include a different macrogrid processor selected from a same micro grid apparatus.

In one embodiment, the process geographically relocates at least onemacro grid processor of a first macro grid, which results in the firstmacro grid having its geographical footprint increased or decreased.

In one embodiment, the alert data packet includes an identification of ascale (S), wherein S is a function of a magnitude of the event (E), anurgency level for responding to the event (U), and a quash time forextinguishing the event (Q). The scale (S) identified in the alert datapacket may be used to determine a total number of processors of the atleast one processor to be selected from each micro grid apparatus duringsaid selecting the at least one processor from each micro grid apparatusin step 1473. In one embodiment, S=(E×U)/Q.

In one embodiment, the artificial intelligence for a first macro grid ofthe plurality of macro grids ascertains that the scale is increasedrelative to the scale identified in the alert data packet which triggersadding at least one macro grid processor to the first macro grid,resulting in the first macro grid having its geographical footprintincreased

In one embodiment, the artificial intelligence for a first macro grid ofthe plurality of macro grids ascertains that the scale is decreasedrelative to the scale identified in the alert data packet which triggersremoving at least one macro grid processor from the first macro grid,resulting in the first macro grid having its geographical footprintdecreased.

Other embodiments, as described supra in conjunction with the process ofFIG. 4C and/or FIG. 4D, are likewise applicable to the process of FIG.4E.

FIG. 5A depicts a micro grid system stack 1500 of 18 processors, inaccordance with embodiments of the present invention. The micro gridsystem stack 1500 comprises a unique micro grid processor 60, twodesignated macro grid processors (1405, 1505) of two corresponding macrogrids, and 15 micro grid processors (as additional processing resources,some or all of which being allocated to the two designated macro gridprocessors (1405, 1505)). The two corresponding macro grids existcontemporaneously and have two corresponding artificial intelligencesco-existing in the same micro grid apparatus (i.e., in the same microgrid system stack 1500).

FIG. 5B depicts two micro grid system stacks (1500, 1510), each stackcomprising 18 processors, in accordance with embodiments of the presentinvention. Each stack is in a different micro grid apparatus. The 18processors in each stack are adjacent to one another and are directlyconnected electrically or wirelessly connected to each other within amicro grid apparatus. The stack 1500 comprises a unique micro gridprocessor 60, two designated macro grid processors (1405, 1505) of twocorresponding macro grids, and 15 micro grid processors (as additionalprocessing resources, some or all of which being allocated to the twodesignated macro grid processors (1405, 1505)). The stack 1510 comprisesa unique micro grid processor 60, three designated macro grid processors(1515, 1505, 1405) of three corresponding macro grids, and 14 micro gridprocessors (as additional processing resources, some or all of whichbeing allocated to the three designated macro grid processors (1515,1505, 1405)).

In FIG. 5B, a first macro grid comprises macro grid processor 1405 ofstack 1500 and macro grid processor 1405 of stack 1510, said first macrogrid having a first artificial intelligence. A second macro gridcomprises macro grid processor 1505 of stack 1500 and macro gridprocessor 1505 of stack 1510, said second macro grid having a secondartificial intelligence. A third macro grid comprises macro gridprocessor 1515 of stack 1510, said third macro grid having a thirdartificial intelligence. Each macro grid in FIG. 5B is formed by theprocess depicted in FIG. 4C or FIG. 4D.

FIG. 5C depicts three micro grid system stacks (1500, 1510, 1530), eachstack comprising 18 processors, in accordance with embodiments of thepresent invention. Each stack is in a different micro grid apparatus.The 18 processors in each stack are adjacent to one another and aredirectly connected electrically or wirelessly connected to each otherwithin a micro grid apparatus. The stack 1510 is disposed between stacks1500 and 1530. The stack 1500 comprises a unique micro grid processor60, two designated macro grid processors (1505, 1405) of twocorresponding macro grids, and 15 micro grid processors (as additionalprocessing resources, some or all of which being allocated to the twodesignated macro grid processors (1505, 1405)). The stack 1510 comprisesa unique micro grid processor 60, three designated macro grid processors(1515, 1505, 1405) of three corresponding macro grids, and 14 micro gridprocessors (as additional processing resources, some or all of whichbeing allocated to the three designated macro grid processors (1515,1505, 1405)). The stack 1530 comprises a unique micro grid processor 60,four designated macro grid processors (1515, 1525, 1505, 1405) of fourcorresponding macro grids, and 13 micro grid processors (as additionalprocessing resources, some or all of which being allocated to the fourdesignated macro grid processors (1515, 1525, 1505, 1405)).

In FIG. 5C, a first macro grid comprises macro grid processor 1405 ofstack 1500, macro grid processor 1405 of stack 1510, and macro gridprocessor 1405 of stack 1530, said first macro grid having a firstartificial intelligence. A second macro grid comprises macro gridprocessor 1505 of stack 1500, macro grid processor 1505 of stack 1510,and macro grid processor 1505 of stack 1530, said second macro gridhaving a second artificial intelligence. A third macro grid comprisesmacro grid processor 1515 of stack 1510 and macro grid processor 1515 ofstack 1530, said third macro grid having a third artificialintelligence. A fourth macro grid comprises macro grid processor 1525 ofstack 1530, said fourth macro grid having a fourth artificialintelligence.

In FIG. 5C: (1) each of the three micro grid system stacks (1500, 1510,1530) has a unique processor 60; (2) one of the micro grid system stacks(1530) has a macro grid processor (1525) not found in the other twoadjacent physical apparatus's (1500, 1510); (3) two of the micro gridsystem stacks (1510, 1530) have a macro grid processor (1515)participating in the same third macro grid; (4) all three of the microgrid system stacks (1500, 1510, 1530) have two macro grid processors(1405, 1505) participating in the first and second macro grid,respectively; and (5) a total of four macro grids are present in thethree micro grid system stacks (1500, 1510, 1530), and are functioningcontemporaneously, each controlled by their own individual artificialintelligence.

FIG. 5D is a diagram of a geographic area 1520 comprising the four macrogrids associated with the three micro grid system stacks (1500, 1510,1530) of FIG. 5C, in accordance with embodiments of the presentinvention. FIG. 5D depicts the micro grid apparatuses that comprise thethree micro grid system stacks (1500, 1510, 1530). The three mobilemicro grid system stacks (1500, 1510, 1530) are adjacent to each otherand wirelessly connected to each other in the manner described supra inconjunction with FIG. 5C. Each micro grid system stack containsdifferent combinations of macro grid processors, which are illustratedby the shape and boundaries of the respective geographical footprint ofthe macro grids. Each geographical footprint in FIG. 5D is identified bythe macro grid processor (1405, 1505, 1515, 1525) included in itsrespective macro grid. Each macro grid is governed by its own artificialintelligence. In one embodiment, the geographic area 1520 is severalhundred meters across.

FIG. 6A is a diagram of a geographic area 1600 comprising 5 macro gridsand 27 micro grid apparatuses, in accordance with embodiments of thepresent invention. FIG. 6A depicts a distribution of micro gridapparatuses within the 5 macro grids. Each micro grid apparatus in FIG.6A comprises its micro grid system stack, as explained supra. Some orall of the 27 micro grid system stacks are wirelessly connected to eachother. Each micro grid system stack contains combinations of macro gridprocessors, which are illustrated by the shape and boundaries of thegeographical footprint of the macro grids respectively. Some suchcombinations of macro grid processors may differ from each other. Eachgeographical footprint in FIG. 6A is identified by the macro gridprocessor (1615, 1620, 1625, 1630, 1635) included in its respectivemacro grid. The two portions of the footprint of the macro grid 1620depicted in FIG. 6A are connected to each other outside of thegeographic area 1600 and thus collectively form a single continuousfootprint. Each macro grid is governed by its own artificialintelligence. In one embodiment, the geographic area 1600 is onekilometer across. At least one micro grid apparatus (denoted by itsmicro grid system stack 1605) is not connected or participant to any ofthe macro grids.

FIG. 6B is a diagram of a geographic area 1640 comprising the 5 macrogrids of FIG. 6A and 12 micro grid apparatuses, in accordance withembodiments of the present invention. FIG. 6B depicts a distribution ofmicro grid apparatuses within the 5 macro grids. The 12 micro gridapparatuses in FIG. 6B is a subset of the 27 micro grid apparatuses inFIG. 6A. The geographical area 1640 of FIG. 6B is later in time than isthe geographical area 1600 of FIG. 6A and either encompasses or is asubset of the geographical area 1600. Each micro grid apparatus in FIG.6B comprises its micro grid system stack, as explained supra. Some orall of the 12 micro grid system stacks are wirelessly connected to eachother. Each micro grid system stack contains combinations of macro gridprocessors, which are illustrated by the shape and boundaries of thegeographical footprint of the macro grids respectively. Some suchcombinations of macro grid processors may differ from each other. Eachgeographical footprint in FIG. 6B is identified by the macro gridprocessor (1615, 1620, 1625, 1630, 1635) included in its respectivemacro grid. Each macro grid is governed by its own artificialintelligence. In one embodiment, the geographic area 1640 is onekilometer across. At least one micro grid apparatus (denoted by itsmicro grid system stack 1605) is not connected or participant to any ofthe macro grids. One of the macro grid macro grids (1620) hasexperienced a decaying artificial intelligence and is disappearing dueto removal of all of its participating macro grid processors. Thegeographical footprints of the other macro grids are reducing in size astheir alert scale value reduces. The distribution of micro gridapparatuses within the 5 macro grids of FIG. 6B differ from thedistribution of micro grid apparatuses within the same 5 macro grids ofFIG. 6A due to the dynamic evolution the 5 macro grids from the timeassociated with FIG. 6A to the time associated with FIG. 6B.

FIG. 6C is a diagram of a geographic area 1660 comprising 5 macro gridsand 12 micro grid apparatuses, in accordance with embodiments of thepresent invention. FIG. 6C depicts a distribution of micro gridapparatuses within the 5 macro grids. The 12 micro grid apparatuses inFIG. 6C are the same micro grid apparatuses as the 12 micro gridapparatuses in FIG. 6B. The geographical area 1660 of FIG. 6C is laterin time than is the geographical area 1640 of FIG. 6B and eitherencompasses or is a subset of the geographical area 1640. Each microgrid apparatus in FIG. 6C comprises its micro grid system stack, asexplained supra. Some or all of the 12 micro grid system stacks arewirelessly connected to each other. Each micro grid system stackcontains combinations of macro grid processors, which are illustrated bythe shape and boundaries of the geographical footprint of the macrogrids respectively. Some such combinations of macro grid processors maydiffer from each other. Each geographical footprint in FIG. 6C isidentified by the macro grid processor (1615, 1620, 1625, 1630, 1635)included in its respective macro grid. Each macro grid is governed byits own artificial intelligence. In one embodiment, the geographic area1660 is one kilometer across. At least one micro grid apparatus (denotedby its micro grid system stack 1605) is not connected or participant toany of the macro grids. One of the macro grids (1620) has experienced adecaying artificial intelligence and is disappearing due to removal ofall of its participating macro grid processors. The geographicalfootprints of the other macro grids are reducing in size as their alertscale value reduces. Directional arrows illustrate an instantaneousdirection in which portions of each of geographical footprints isdynamically moving, which may represent an expansion or contraction ofeach macro grid. The distribution of micro grid apparatuses within the 5macro grids of FIG. 6C have not changed from the distribution of microgrid apparatuses within the same 5 macro grids of FIG. 6C during theperiod of time from the time associated with FIG. 6B to the timeassociated with FIG. 6C.

FIG. 6D is a diagram of a geographic area 1680 comprising 5 macro gridsand 12 micro grid apparatuses, in accordance with embodiments of thepresent invention. FIG. 6D depicts a distribution of micro gridapparatuses within the 5 macro grids. The geographical area 1680 of FIG.6D is later in time than is the geographical area 1660 of FIG. 6C andeither encompasses or is a subset of the geographical area 1660. The 5macro grids in the geographic area 1680 in FIG. 6D are associated with asubset of the 12 micro grid apparatuses and consist of the 5 macro gridsof FIG. 6C. Each micro grid apparatus in FIG. 6D comprises its microgrid system stack, as explained supra. Some or all of the 12 micro gridsystem stacks are wirelessly connected to each other. Each micro gridsystem stack contains combinations of macro grid processors, which areillustrated by the shape and boundaries of the geographical footprint ofthe macro grids respectively. Some such combinations of macro gridprocessors may differ from each other. Each geographical footprint inFIG. 6D is identified by the macro grid processor (1615, 1625, 1630,1635) included in its respective macro grid. Each macro grid is governedby its own artificial intelligence. In one embodiment, the geographicarea 1680 is one kilometer across. At least one micro grid apparatus(denoted by its micro grid system stack 1605) is not connected orparticipant to any of the macro grids. One of the macro grids (1620) hasexperienced a decaying artificial intelligence and is disappearing dueto removal of all of its participating macro grid processors. At thetime associated with FIG. 6D, the macro grid 1620 includes micro gridapparatuses only outside of geographical area 1680 and is therefore notexplicitly identified in FIG. 6D. The geographical footprints of theother macro grids are reducing in size as their alert scale valuereduces. Only 4 macro grids of the 5 macro grids in FIG. 6C remain inFIG. 6D and have been reduced in size and continue to be reduced in sizeas their alert scale values are being reduced, namely the 4 macro gridsidentified by the respective macro grid processors 1615, 1625, 1630,1635. Three micro grid apparatuses (1645, 1650, 1655) are mobile (e.g.,in vehicles) that do not appear in FIG. 3C, and their GPS systemsindicate a change in ‘location value’ that is recognized by theirgoverning artificial intelligences to maintain their wirelessconnections and macro grid participation. Similar to FIG. 6B, thedistribution of micro grid apparatuses within the 5 macro grids of FIG.6D differ from the distribution of micro grid apparatuses within thesame 5 macro grids of FIG. 6A and include new micro grid apparatuses(e.g., 1645, 1650, 1655) due to the dynamic evolution and spatialmigration of the 5 macro grids from the time associated with FIG. 6C tothe time associated with FIG. 6D.

The expansion and contraction of artificial intelligence footprints isgenerally dynamic and changing.

Each macro grid in FIG. 5D, FIG. 6A, FIG. 6B, FIG. 6C, FIG. 6D, and/orany other macro grid described herein, is formed by the process depictedin FIG. 4C, FIG. 4D, FIG. E, or combinations thereof.

FIG. 7A depicts a micro grid system stack 1700 of 18 processors, inaccordance with embodiments of the present invention. The micro gridsystem stack 1700 comprises a unique micro grid processor 60, fourdesignated macro grid processors (1705) of four corresponding macrogrids, and 13 micro grid processors 65 (as additional processingresources, some or all of which may be allocated to the four designatedmacro grid processors (1705)). The four corresponding macro grids existcontemporaneously and have four corresponding artificial intelligencesco-existing in the same micro grid apparatus (i.e., the same micro gridsystem stack 1700). Also shown are the buses (micro grid system bus1205, standard system buses 1210 and 1215, macro grid system bus 1220)for data transfer and software connections. The unique micro gridprocessor 60 maintains an orderly macro stack of macro grid processorsby selecting the next available micro grid processor in the linear microgrid stack for operating system change to a macro grid processor. Aprocess of ‘stack house keeping’ by the unique processor 60 ensuresstack efficiency and micro grid processor availability for assignment ofmicro grid processing resources 65 to alert requests.

FIG. 7B is a diagram showing a micro grid system stack 1710 of 18processors, displaying the extension capability of the buses, inaccordance with embodiments of the present invention. The micro gridsystem stack 1710 comprises a unique micro grid processor 60, fourdesignated macro grid processors (1705) of four corresponding macrogrids, and 13 micro grid processors 65 (as additional processingresources, some or all of which may be allocated to the four designatedmacro grid processors (1705)). The four corresponding macro grids existcontemporaneously and have four corresponding artificial intelligencesco-existing in the same micro grid apparatus (i.e., the same micro gridsystem stack 1700). Also shown are the buses (micro grid system bus1205, standard system buses 1210 and 1215, macro grid system bus 1220)for data transfer and software connections. The unique micro gridprocessor 60 is embodied at the base (in position zero) of the microgrid system stack 1710. The micro grid system bus 1205 and macro gridsystem bus 1220 can be extended to provide their bus functionality from9 to 18 or more micro grid processors with their own individualoperating systems. The combined standard system buses 1210 and 1215,micro grid system bus 1205 and macro grid system bus 1220 can beextended to a plurality of other micro grid processor stacks by anirregular shaped module or ‘bridge’, physically connecting other microgrid apparatuses together.

FIG. 7C is a diagram showing a micro grid system stack 1730 of 18processors, displaying operating system change and re-assignment asartificial intelligence requirements of the apparatus are extinguishedwithin a single apparatus, in accordance with embodiments of the presentinvention. The micro grid system stack 1730 comprises a unique microgrid processor 60, a designated macro grid processor 1405 of acorresponding macro grid, 3 micro grid processors 66, and 13 micro gridprocessors 65. Also shown are the buses (micro grid system bus 1205,standard system buses 1210 and 1215, macro grid system bus 1220) fordata transfer and software connections. The unique processor 60constantly monitors alert data interrogated from its attached local andremote sensors, as well as the alert data issued by the macro gridartificial intelligence it is participating in. The unique processor 60constantly receives alert values of scale from a plurality of sources.The alert value of scale for the macro grid processor 1405 indicates itis still required to participate in providing processing resources forthe artificial intelligence within that macro grid. However, the 3 macrogrid processors 66 have been returned to micro grid operating systems astheir artificial intelligences have been extinguished. The next step isfor the unique processor 60 in the micro grid system stack to applyfurther ‘housekeeping’ and relocate the operating system of the macrogrid processor 1405 at stack position four to stack position one. Thethree freshly re-assigned micro grid processors 66 are then coalescedwith the other 13 micro grid processors 65 by the unique processor 60'sinstruction, resulting in a linear and uninterrupted stack of 16 microgrid processors (not shown), ready for the next alert.

The scale (S) of an alert is computed by the artificial intelligencefrom interrogation of alert data either detected directly via the uniqueprocessor 60 within the structure 500 (see FIG. 4B) from the connectedlocal sensors and/or remote sensors via the micro grids I/O module 410and communications module 425 (see FIG. 4B), or received (see step 1455of FIG. 4D) from an external micro grid apparatus or a macro grid thatis wirelessly connected to the micro grid apparatus 100.

Adjacent wirelessly connectable physical apparatuses respond to thereceived (1450 to 1470) alert and join the macro grid along withprocessing resources as required by the artificial intelligence. Thecommunicational data may be in the TCP/IP packet format.

The scale (S) of an alert is computed and used by the artificialintelligence to constantly indicate an alert value to all participatingwirelessly connected micro grid unique processors (60) responsible forassigning macro grid processors and managing micro grid processors andresources. The scale (S) indicates, to the unique processor 60, arequirement to conscript more micro grid processors for the artificialintelligence, maintain the status quo, or reduce resource participation,which facilitates scalability of the dynamic functional use of the microgrid systems.

The artificial intelligence processes the data to counter the event withphysical action and activity against the cause of the alert. This isundertaken by instruction to the available intelligent actuators (notshown) controlled by the unique operating system of the unique processor60 in each micro grid apparatus. Alert interrogation provides thenecessary feedback to the artificial intelligence to assess theeffectiveness of the counter, which is then adjusted accordingly. Thiscounter action and feedback mechanism may occur within a short period(e.g., milliseconds).

There are many examples for using the present invention, wherein microgrid and macro grid alert processing can be provided for artificialintelligence to take pro-active control of situations, initiated by theraising of alarms and alerts. Micro grid and macro grid technology couldbe deployed everywhere, resolving issues, counteracting events, andcontrolling remote circumstances that would otherwise requirecentralized decision making by people, who are not always available24×7×365.

The following three hypothetical examples illustrate use of the presentinvention.

1. A huge forest fire erupts overnight in the hills behind Los Angeles(LA). The wind direction and fire intensity indicates an event to someouter LA suburbs within 48 hours. 427 fire trucks and 3 sky-cranehelicopters have been dispatched by the greater LA Fire Authority intothe area. Micro grids are embedded in all vehicles, and monitor heat,wind, smoke, and location information from their intelligent sensors. Asmoke alert is raised by one of the micro grids. Quickly a macro grid isformed between all vehicles and the artificial intelligence takescontrol of the dangerous event. Each vehicle has interactive voice andvideo. The artificial intelligence interfaces with these communicationdevices and issues task assignments to the LA Fire Authority Units. Theartificial intelligence provides a constant stream of updatedinformation to central control, police, ambulance, and news media. Theforest fire is surrounded by fire fighting efficiency and resourceco-ordination. Within 36 hour, the potential disaster is arrested andsuffocated. The wireless macro grid decays and separates back toindividual micro grid processing. The mayor thanks the LA Fire Authorityfor another job well done.2. It is year 2017 and the recently arrived NASA roving vehicles onTitan have been transmitting astounding images and data to Earth centralcontrol. A micro meteorite impacts 200 meters from one of the rovers,creating a sudden geological landscape change, unseen by earthcontrollers that may prove destructive for the $4 billion mission. Largefreshly formed terrain fractures are detected by micro grid sensors onthe rovers. A macro grid is quickly formed, and the generated artificialintelligence overrides current forward movement instructions and stopsthe affected rover immediately. This averts a potential rover loss, ascommunication with earth control is over 16 minutes (turnaround). Theartificial intelligence re-evaluates the terrain and provides Earthcontrollers with Titan ground distance images and new atmospherictemperature, dust, gas and pressure data from the direction of themeteorite impact. The artificial intelligence decays and the individualmicro grid unique processor in the command vehicle waits revised missioninstructions.3. It is 6.30 AM on a winter day in year 2012, and 400,000 vehicles areon the M1 motorway in England due to people traveling to work. Microgrid computing has been embedded in vehicles since year 2009 andapproximately 15% of the vehicles have the technology. A thick fog rollsin over a 12 mile portion of the M1 motorway. Micro-grid sensors withinthe vehicles react to the arrival of the thick fog and indicate thedensity and GPS location to the other collaborating macro grid connectedvehicles. Quickly, a fog pattern alert is generated by the artificialintelligence and conveyed to British motorway authorities includingweather forecasters, television stations, and radio stations. Thecollaborating processors in the macro grid dispatch and share anunsolicited alert image on their dashboard LCD screens indicatingtopographic size and density of the fog. Safely, the vehicles slow downinfluencing other non-macro-grid vehicle drivers to do the same. Imageprocessing, sensor sampling, and information up-dates are maintained bythe artificial intelligence until all vehicles have passed through thefog, and the fog itself lifts for another fine day.B. Micro Grid Bridge Structures

FIG. 8 is a block diagram of a computer system 51, comprising a microgrid processor apparatus 1320, irregular shaped modules connected to themicro grid processor apparatus 1320 via respective connectioninterfaces, and a bridge module 2010 connecting to the micro gridapparatus 1320 to another micro grid apparatus 70, in accordance withembodiments of the present invention. The computer system 51 of FIG. 8is the computer system 50 of FIG. 1 with the bridge module 2010replacing the irregular shaped module 420 of FIG. 1 and the addition ofthe micro grid apparatus 70, wherein the micro grid processor apparatus1320 in FIG. 8 and the micro grid apparatus 100 in FIG. 1 are the samethe micro grid processor apparatus. The bridge module 2010 connects themicro grid processor apparatus 1320 to the micro grid apparatus 70 via aconnection interface 55 as shown. An example of the micro grid apparatus70 is a micro grid power hub apparatus 3000 in FIG. 15 as discussedinfra. A power hub apparatus is defined as a micro grid apparatus whosecentral area 125 comprises a plurality of rechargeable batteries.

The bridge module 2010 comprises bridge units 2011 and 2012 connectedtogether by a bridge hinge 2035. The bridge hinge 2035 provides thebridge module 2010 with sufficient physical flexibility to enable thebridge units 2011 and 2012 to dock and be latched into respectivedocking bays of the micro grid processor apparatus 1320 and the microgrid apparatus 70.

The computer system 51 is an example of a “bridge structure”. Generally,a micro grid bridge structure (or “bridge structure” for short) is aplurality of micro grid apparatuses interconnected by at least onebridge module.

FIG. 9A is a diagram showing the bridge module 2010 of FIG. 8, inaccordance with embodiments of the present invention. The bridge module2010 has a bi-polygonal shape and comprises a central hinged connectionjoint (2035) and eight light emitting diodes (LED's) (two sets of 2015,2020, 2025, 2030). The bi-polygonal shaped bridge module 2010 may bemanufactured to fit perfectly within the docking bays. In oneembodiment, there is less than 1 mm of gap tolerance around the noncontact edges of two complex shapes, with a radius of 5 cm, physicallyadjacent to each other and separated by 1.5 cm, and with the bridgemodule 6.5 cm in length and 3 cm wide at the hinged connection joint2035. The bridge module 2010 physically and electrically connects at the‘V’ shaped connection interface 55 (see FIG. 8) along the edge of thedocking bay 450 (see FIG. 2A) of each of the adjacent complex structurescoupled to each other by the bridge module 2010, by pushing down on thebridge module 2010 and latching the bridge module 2010 into place alongthe edge of the docking bay 450 of the complex shape's radial arm 110(see FIG. 2A).

The latching mechanism is provided as a raised and rounded protrusion(e.g., of ˜1.5 mm height×˜3.5 mm length) along the latching edge 311 ofbridge units 2011 and 2012 (See FIG. 9A and FIG. 11B). This protrusionfits a receptacle with the same characteristics to receive the shape onall the radial arm edges of the complex shapes. The connection edge 310is the edge location of the ‘V’ shaped connection interface 55 (see FIG.8).

The central hinged joint 2035 provides the bridge with the physicalflexibility required for the bridge module 2010 to dock and latch downinto respective docking bays of two adjacent complex shapes.

Eight optical LED's (two sets of 2015, 2020, 2025, 2030) within thebridge module 2010 provide visual activity monitoring, and infra red(IR) sensing and data transfer, of buses 1205, 1210, 1215, 1220,respectively (see FIG. 9B). In particular, the LEDs 2030 are connectedto the micro grid system bus 1205, the LEDs (2025, 2020) are connectedto the standard system bus (1210, 1215), and the LEDs 2015 are connectedto the macro grid system bus 1220. The LED's (2030, 2025, 2020, 2015)provide functional use of data transfer and attachment for data busmonitoring devices, visual inspection for micro grid and/or macro gridsystem integrity, system maintenance, fault determination, of the buses(1205, 1210, 1215, 1220), by engineers and robots.

FIG. 9B is a diagram showing an internal structure of a bridge 2040within the bridge module 2010 of FIGS. 8 and 9A, in accordance withembodiments of the present invention. The bridge 2040 comprises acomposite bus 1720 which includes the micro grid system bus 1205, thestandard system bus (1210, 1215), and the macro grid system bus 1220.The composite bus 1720 electrically connects along the edge of thedocking bay of the two adjacent micro grid apparatuses at their ‘V’point 305 (see FIG. 11B). The internal structure of the bridge 2040embodies electronics and serial data buffers suitable for optical andinfra red transfer of data to observers, and data monitoring equipment,for purposes of maintenance and repair.

FIG. 10A is a diagram of an assembled structure 2050, in accordance withan embodiments of the present invention. The assembled structure 2050depicts a micro grid apparatus 1310 comprising the four irregular shapedmodules 415, 410, 200, 425, and the bridge module 2010 that contains theeight LED's (two sets of 2030, 2025, 2020, 2015—see FIG. 9A). The microgrid apparatus 1310 is representative of the micro grid apparatus 1300of FIG. 3A subject to the bridge module 2010 being specific to FIG. 10A.The assembled structure 2050 is an example of a basic mobile micro gridapparatus, and a laptop micro grid system apparatus, (i.e., without abridge module, the assembled structure 2050 is a ‘single’ micro gridapparatus; with a bridge module and connected to another complex shape,the assembled structure 2050 forms a ‘dual’ micro grid apparatus). Withinclusion of the bridge module 2010, the assembled structure 2050assembles with other complex shapes to form more complex micro grid andmacro grid apparatuses. In FIG. 10A, the irregular shaped modules 415,410, 200, 425, and the bridge module 2010 are each inserted into anavailable docking bay of the complex shape of the micro grid apparatus1310.

FIG. 10B depicts a vertical structure 2055 of a cross-sectional viewalong a line A-B depicted in FIG. 10A, in accordance with an embodimentsof the present invention. The vertical structure 2055 is between pointsA and B. The vertical structure 2055 depicts the conjunction of theirregular shaped module 200 with the micro grid apparatus 1310 at a ‘V’shaped connection point 305 and connection edge 310 at bridge module2014 (see FIG. 11B) which is the location on the micro grid apparatus1310 used by the bridge module 2014 to attach and link two complex microgrid processor modules together, as described infra in conjunction withFIG. 11B.

FIG. 11A depicts a micro grid bridge structure 2060, in accordance withembodiments of the present invention. The micro grid bridge structure2060 is a bridge structure that comprises three micro grid apparatuses(1309, 1310, 1311) connected by two bridge modules (2014, 2010)containing eleven irregular shaped modules, including: six RAM modules(200), two 802.11s Mesh Wireless modules (415), two 802.11gCommunications modules (425), and one I/O module (410). The bridgemodules 2010 and 2014 link the micro grid apparatus 1310 to the microgrid apparatus 1309 and 1311, respectively. In one embodiment, the microgrid bridge structure 2060 is an example of a desk-top micro grid twinbridge apparatus.

While FIG. 11A depicts the micro grid bridge structure 2060 ascomprising three micro grid processor apparatuses, the micro grid bridgestructure 2060 generally comprises three micro grid apparatuses (1311,1310, 1309), wherein each such micro grid apparatus may be either amicro grid processor apparatus or a micro grid power hub apparatus. Forexample, FIG. 16B (discussed infra) depicts a similar micro grid bridgestructure 3400 comprising three micro grid apparatuses, with one microgrid processor apparatus (1310) disposed between two micro grid powerhub apparatuses (3000A, 3000B).

Generally, the micro bridge structure of FIG. 11A or of FIG. 16Bcomprises a first micro grid apparatus (1311), a second micro gridapparatus (1310), and a third micro grid apparatus (1309), a firstbridge module (2014), and a second bridge module (2010). A first bridgeunit and a second bridge unit of the first bridge module (2014) isrespectively latched into a first docking bay of the second micro gridapparatus (1310) and a docking bay of the first micro grid apparatus(1311). A first bridge unit and a second bridge unit of the secondbridge module (2010) is respectively latched into a second docking bayof the second micro grid apparatus (1310) and a docking bay of the thirdmicro grid apparatus (1309). In FIG. 11A, the first micro grid apparatusis a processor apparatus (1311), the second micro grid apparatus is aprocessor apparatus (1310), and the third micro grid apparatus is aprocessor apparatus (1309). In FIG. 16B, the first micro grid apparatusis a power hub apparatus (3000A), the second micro grid apparatus is aprocessor apparatus (1310), and the third micro grid apparatus is aprocessor apparatus (3000B).

FIG. 11B depicts a cross-sectional view 2065 along a line C-D depictedin FIG. 11A, in accordance with an embodiments of the present invention.The cross-sectional view 2065 shows three stages of assembly (1, 2, 3)of the bridge module 2014, into the docking bays of two physicallyadjacent (and multi-layered printed circuit board mounted) micro gridapparatuses 1311 and 1310.

In its unmounted and non-connected state, the bridge hinge 2035 rests atan angle of about 120 degrees, by light spring (not shown) tension. Inone embodiment, the bridge hinge 2035 is ˜0.4 cm in height at the centrehinge and 1 cm in height at the ‘V’ shaped connection points, at both ofits ends, and a latching mechanism is provided as a raised and roundedprotrusion (320) of ˜1.5 mm height×˜3.5 mm length along the edge of bothof its sides (311), and both halves of the bridge.

The bridge module 2014 is positioned, and lowered in the center (againstlight spring tension), into alignment with two single circuit boardmounted micro grid apparatuses 1311 and 1310, with adjacent docking baysavailable to receive the bridge module 2014. The bridge module 2014 islatched into place (against light spring tension) when the ‘V’ shapedconnection edge 310 on the bridge module 2014 is in conjunction with the‘V’ shaped connection point 305 on the micro grid apparatus 1310. Thelatching mechanism, a protrusion 320 on the bridge module 2014, fits areceptacle (i.e., insertion point) with the same characteristics toreceive the shape, on all the radial arm edges of the micro gridapparatus 1310.

FIG. 11C is a diagram of a micro grid bridge structure 2070, inaccordance with an embodiments of the present invention. The micro gridbridge structure 2070 is a bridge structure comprising a stack set 2075of a micro grid complex shape (e.g., the complex micro grid structure2060 in FIG. 11A). The stack set 2075 is a set of three micro gridsystem stacks 66. Each micro grid system stack 66 in the stack 2075comprises 18 processors, wherein the 18 processors of each stack 66include the unique processor 60. The three stacks 66 are bridged to forma contiguous micro grid system of fifty four processors along anextended composite bus 1720 which includes the micro grid system bus1205, the standard system bus (1210, 1215), and the macro grid systembus 1220.

The assembled micro grid bridge structure 2070 includes a specializedgrid of the three unique processors 60. This specialized grid of threeunique processors 60 is structured so that each unique processor 60 ispositioned by software determination to be in a load balanced positionin the complex micro grid apparatus 2070 to best serve and apportion thealerts and macro grid processor assignment requirements demanded by theartificial intelligence(s) operating in their macro grids.

The complex micro grid structure 2070 is a fifty four micro gridprocessor system (suitable in size for a ‘next generation’ desktop cloudcomputing device) and is further scalable, to assemble into a basiccloud computing server of a micro grid bridge structure 2080 (see FIG.12A) containing 108 processors, embodying a stack set of six micro gridsystem stacks 66.

FIG. 12A is a diagram of a micro grid bridge structure 2080, inaccordance with an embodiments of the present invention. The micro gridbridge structure 2080 is a bridge structure that comprises a centralmicro grid apparatus 1330 whose docking bays contain only bridge unitsof five corresponding bridge modules 2010, and that further comprisesfive micro grid apparatuses 1310 each connected to the central microgrid apparatus 1330 by the five corresponding bridge modules 2010. Thefive micro grid apparatuses 1310 collectively comprise twenty irregularshaped modules.

The micro grid bridge structure 2080 is suitable as a cloud computingserver, containing 108 processors, assembled as a complex composite gridarray of six micro grid apparatuses, each having a complex shape.

The micro grid bridge structure 2080 embodies, by selective design,seventeen RAM modules (200) (e.g., seventeen terabytes of random accessmemory), one 802.11s Mesh Wireless module (415), one 802.11gCommunications module (425), and one I/O module (410).

The micro grid bridge structure 2080 includes a specialized grid of thesix unique processors 60. The unique processors 60 are not shown in FIG.12A. A representative unique processor 60 is depicted in FIG. 8 for themicro grid apparatus 1320 which is analogous to the micro grid apparatus1310 in FIG. 12A. The micro grid bridge structure 2080 is structured sothat each of the six unique processors 60 are positioned by softwaredetermination, to be in a load balanced position in the complex microgrid to best serve and apportion the alerts and macro grid processorassignment requirements demanded by the artificial intelligence(s)operating in their macro grids.

The micro grid bridge structure 2080 is an example of a server microgrid five bridge apparatus. In one embodiment, the micro grid bridgestructure 2080 (e.g., a cloud computing server with 108 processors) hasan overall physical diameter of 30 cm. and a profile height less than1.5 cm.

While FIG. 12A depicts the micro grid bridge structure 2080 ascomprising six micro grid processor apparatuses (i.e., five processorapparatuses 1310 and one central processor apparatus 1330), the microgrid bridge structure 2080 generally comprises six micro gridapparatuses, wherein each such micro grid apparatus may be either amicro grid processor apparatus or a micro grid power hub apparatus.

The micro grid bridge structure 2080 is a “centric bridge structure”. Acentric bridge structure comprises a central micro grid apparatus(1330), N outer micro grid apparatuses (1310; N=5) such that N is atleast 2, and N bridge modules (2010), wherein each bridge module of theN bridge modules comprises a first bridge unit latched to a docking bayof the central micro grid apparatus (1330) and a second bridge unitlatched to a docking bay of a corresponding micro grid apparatus (1310)of the N outer micro grid apparatuses.

FIG. 12B is a diagram of a micro grid bridge structure 2090, inaccordance with an embodiments of the present invention. The micro gridbridge structure 2090 is a bridge structure that comprises a set 2095 ofmicro grid system stacks 66 (more specifically, a set of six micro gridsystem stacks 66). Each micro grid system stack 66 comprises 18processors, wherein the 18 processors of each stack 66 include theunique processor 60. The six stacks 66 are bridged so as shown to form amicro grid system of 6×18 (i.e., 108) processors along extendedcomposite buses 1720 which includes the micro grid system bus 1205, thestandard system bus (1210, 1215), and the macro grid system bus 1220.

The micro grid bridge structure 2090 is a one hundred and eight microgrid processor system (i.e., suitable in size for a ‘next generation’cloud computing server device) and is further scalable, to assemble intoa complex micro grid mosaic apparatus 2300 (see FIG. 14A) containing sixhundred and forty eight processors.

FIG. 13A is a diagram of a micro grid bridge structure 2100 having acomplex micro grid ring structure, in accordance with an embodiments ofthe present invention. The complex micro grid ring structure 2100 is abridge structure that comprises ten micro grid apparatuses 1310connected by ten bridge modules 2010 in a closed ring formation. The tenbridge modules 2010 collectively comprise thirty irregular shapedmodules. The complex micro grid ring structure 2100, which is alsosuitable for military, research and scientific applications, includesone hundred and eighty processors, assembled as a complex composite gridring structure of ten micro grid apparatuses.

Generally, the complex micro grid ring structure of the presentinvention comprises or consists of N micro grid apparatuses in a closedring formation such that N is at least 3. Representing the N micro gridapparatuses as A₁, A₂, . . . , A_(N), the closed ring formation ischaracterized by the N micro grid apparatuses being bridged together inthe sequence of: A₁, A₂, . . . , A_(N), A₁.

While FIG. 13A depicts the micro grid bridge structure 2100 ascomprising ten micro grid processor apparatuses, the micro grid bridgestructure 2100 generally comprises ten micro grid apparatuses (or Nmicro grid apparatuses generally), wherein each such micro gridapparatus may be either a micro grid processor apparatus or a micro gridpower hub apparatus.

The complex micro grid ring structure 2100 embodies, by selectivedesign, twenty RAM modules (200) (e.g., twenty terabytes of randomaccess memory), five 802.11g Communications modules (425), and five I/Omodules (410). Each micro grid apparatuses 1310 comprises two RAMmodules 200, one 802.11g Communications module 425, or I/O module 410,and one bridge module 2010 to connect to the next adjacent micro gridring apparatuses 1310.

The complex micro grid ring structure 2100 allows for an alternativeexperimental very high speed mono-directional token ring and similar busarchitectures, for testing and improving the micro grid standard systembus (1210, 1215) use and data interchange design; the micro grid systembus (1205) use and governance design; and the macro grid system bus(1220) use and artificial intelligence design, for the enablement offuture superior micro grid and macro grid design and performanceefficiencies (see FIG. 13B, discussed infra, for a depiction of thebuses 1205, 1210, 1215, 1220).

The complex micro grid ring structure 2100 comprises five I/O modules(410) which provide for access to and from large volume disk drivestorage arrays.

In one embodiment, the complex micro grid ring structure 2100 (e.g., anexperimental research computing micro grid ring) has an overall physicaldiameter of 40 cm. and a profile height less than 1.5 cm, and is anexample of a complex ring micro grid apparatus. The 20 cm diameter spacein the physical centre of the structure (2100) (and its mountableprinted circuit board) provides, for a relatively large volume of airflow to move through the apparatus, for purposes of cooling.

Multiple stacking of micro grid ring structures (2100) provides for newmainframe cylindrical structural designs.

FIG. 13B is a diagram of a complex micro grid ring structure 2200, inaccordance with an embodiments of the present invention. The complexmicro grid apparatus 2200 represents the complex micro grid ringstructure 2100 of FIG. 13A and is a bridge structure that comprises aset 2210 of ten micro grid system stacks 66. Each micro grid systemstack 66 comprises 18 processors, wherein the 18 processors of eachstack 66 include the unique processor 60. The ten stacks 66 are bridgedas shown to form a continuous micro grid ring system of 180 processorsattached to a composite micro grid bus (1720) ring. Each micro grid bus1720 includes the micro grid system bus 1205, the standard system bus(1210, 1215), and the macro grid system bus 1220. The complex micro gridapparatus 2200 includes a specialized grid of ten unique processors 60.

FIG. 14A is a diagram of a micro grid bridge structure having a complexmicro grid mosaic apparatus 2300, in accordance with an embodiments ofthe present invention. The complex micro grid mosaic apparatus 2300 is abridge structure that comprises thirty six micro grid apparatuses 1310connected by forty bridge modules 2010, containing one hundred selectedirregular shaped modules (200, 415, 425, 410, 420).

The complex micro grid mosaic apparatus 2300 is suitable as a largecloud computing polygonal mosaic micro grid system and embodies microgrids, macro grids, and unique processor grids within a singleapparatus.

The complex micro grid mosaic apparatus 2300 embodies six hundred andforty eight processors, assembled as a very complex composite micro gridarray from thirty six micro grid apparatuses 1310.

The complex micro grid mosaic apparatus 2300 embodies, by selectivedesign, eighty-two RAM modules (200) (e.g., eighty-two terabytes ofrandom access memory), six 802.11s mesh wireless modules (415), six802.11g communications modules (425), five I/O modules (410), and oneGPS module (420).

The complex micro grid mosaic apparatus 2300 includes a specialized gridof the thirty-six unique processors (60), and is structured so that eachof the thirty-six unique processors 60 is positioned by softwaredetermination to be in a load balanced position in the complex microgrid mosaic to best serve and apportion the alerts and macro gridprocessor assignment requirements demanded by the artificialintelligence(s) operating in their macro grids.

In one embodiment, the complex micro grid mosaic apparatus 2300 (e.g., alarge cloud computing polygonal mosaic micro grid system.) has anoverall physical diameter of ˜80 cm. and a profile height less than 1.5cm, and is an example of a large complex mosaic micro grid apparatus.

Multiple stacking of these micro grid mosaic apparatuses (2300) providesfor new large mainframe design architectures, containing a plurality ofmicro grid processors.

The complex micro grid mosaic apparatus 2300 comprises M centric bridgestructures such that M>1. See FIG. 12A and the discussion thereof whichillustrates and describes a centric bridge structure.

In a generalized micro grid bridge structure whose scope includes themicro grid bridge structure of both FIGS. 12A and 14A, the generalizedmicro grid bridge structure comprises M centric bridge structures suchthat M is at least 1. Each centric bridge structure comprises a centralmicro grid apparatus, N outer micro grid apparatuses such that N is atleast 2, and N bridge modules. Each bridge module of the N bridgemodules comprises a first bridge unit latched to a docking bay of thecentral micro grid apparatus and a second bridge unit latched to adocking bay of a corresponding micro grid apparatus of the N outer microgrid apparatuses. The generalized micro grid bridge structure comprisesa plurality of micro grid apparatuses that includes the central microgrid apparatus and the N outer micro grid apparatuses of the M centricbridge structures. The generalized micro grid bridge structure alsocomprises a plurality of bridge module that includes the N bridgemodules of the M centric bridge structures. In FIG. 12A, M=1. In FIG.14A, M>1 and each centric bridge structure of the M centric bridgestructures is bridged by at least one other bridge module of theplurality of bridge modules to a corresponding at least one othercentric bridge structure of the M centric bridge structures.

While FIG. 14A depicts the micro grid bridge structure 2300 ascomprising N*M micro grid processor apparatuses, the micro grid bridgestructure 2300 generally comprises N*M micro grid apparatuses, whereineach such micro grid apparatus may be either a micro grid processorapparatus or a micro grid power hub apparatus.

FIG. 14B is a diagram of a complex micro grid mosaic apparatus 2400, inaccordance with an embodiments of the present invention. The complexmicro grid apparatus 2400 is a representation of the complex micro gridmosaic apparatus 2300 of FIG. 14A and is a bridge structure thatcomprises a set 2410 of thirty six micro grid system stacks 66. Eachmicro grid system stack 66 comprises 18 processors, wherein the 18processors of each stack include the unique processor 60. The thirty sixstacks 66 are bridged as shown to form a complex micro grid mosaic arrayof 648 processors, including a specialized grid array of thirty sixunique processors (60), and interconnected and extendable compositebuses (1720). Each micro grid bus 1720 includes the micro grid systembus 1205, the standard system bus (1210, 1215), and the macro gridsystem bus 1220 (see FIG. 5C). The complex micro grid mosaic apparatus2400 includes a specialized grid of thirty six unique processors 60.

In one embodiment, the complex micro grid mosaic apparatus 2400 is a 648micro grid processor system (i.e., suitable in size for a large cloudcomputing polygonal mosaic micro grid system) and is further scalable,to assemble into new large mainframe polyhedral structural designs,containing a plurality of micro grid processors.

Thus, a “cloud” of the present invention is any complex apparatus (i.e.,any complex micro grid apparatus or associated set of micro grid systemstacks or a cloud computing polygonal mosaic, such as any of the microgrid bridge structures 2060, 2070, 2080, 2090, 2100, 2200, 2300, 2400),characterized by a plurality of micro grid apparatus such that the microgrid apparatus are interconnected by at least one bridge module.

In order to completely facilitate cloud computing, the present inventionprovides an entirely new computational micro grid technology to lift thecomputing industry to the next platform, embracing structures of thepast but also facilitating new structures for the future.

The new fundamental computing elements of the present invention arescalable from the very tiny to the very large, so that software systemscan traverse the entire hardware product range.

Cloud computing according to the present invention is available andsustainable not only in fixed locations, but also in mobile and remotelocations, and is able to be serviced by engineers and robots and/orplugged into power grids.

The present invention provides for the diversity of functional use thatcloud computing utilizes, for computational involvement of the verysmall to the very large, for the connection to everything, everywhere,all the time, for ‘On Demand’ requests for information, for reaction toalerts and pro-active resolve by artificial intelligence, for artefactand archive storage, all intertwined with the growing computationalneeds of humanity.

The following example illustrates the use of cloud computing accordingto the present invention. This example comprises wireless connectivityof twelve micro grid apparatuses embedded in vehicles on a freeway,adjacent to each other, and moving at fifty miles per hour. Eachindividual micro grid apparatus has a unique processor 60 that isconstantly monitoring for alerts and task requests, from sensorsattached to the vehicles, and keyboard requests from individuals withinthe vehicles.

A macro grid containing an artificial intelligence is generated betweenthe apparatus's when alerts and requests are received. Alerts andrequests can be anything from smoke detector alerts on or within thevehicles, to stock exchange data requests by the passengers. There maybe a plurality of alert and request types.

The artificial intelligence (macro grid) expands itself by conscriptingother wirelessly adjacent micro grid processors to assist with computingthe alert or request. Escalation is the result of an increased change inalert scale. This cloud computing process is constantly occurring andevolving. One macro grid containing an artificial intelligence isconnected to the Internet for stock exchange information transfer, whileanother macro grid has been generated amongst the four adjacent leadingvehicles in the group of twelve, reacting to three additional smokealerts to the one smoke alert the another macro grid has itselfdetected. The another macro grid needs to determine whether each alertis unique or is a larger issue as the vehicles pass by a fire along sidethe freeway. Each artificial intelligence determines what to do abouttheir request or alert.

The artificial intelligence seeking the stock exchange data, determinesthat another passenger in another one of the twelve vehicles has justcoincidentally requested the same information, and copies and transfersthe fresh data to satisfy the request without requiring access to thehost server containing the stock exchange information. The artificialintelligence decides to maintain itself and its access to the Internetshould further World Wide Web requests occur within the adjacentvehicles in the next 3 minutes.

The artificial intelligence reacting to the smoke alert has determinedthat it is both a passenger who is smoking in the vehicle and a scrubfire outside the vehicle. This artificial intelligence illuminates avisual cigarette smoke warning message to the passengers on thedashboard display console and the display panels in the rear of thefront passengers head rests within the vehicle that originated the localalert. Health advertising messages (from advertising agencies on theweb) are also displayed on the liquid crystal display panels by theartificial intelligence.

The artificial intelligence also conscripts additional micro gridprocessors from one of the other four vehicles that raised a higheralert value of the scrub fire and migrates the majority of itscomputational power to that vehicle. It determines that three other leadvehicles have now also detected the scrub fire smoke, and synchronizes agradual speed change and increased vehicle distance gap between alltwelve vehicles, using micro grid controlled actuators on the vehicles.Visual messages are also displayed on the driver's dashboard consoles.Fire prevention advertising messages (from advertising agencies on theweb) are also displayed on the liquid crystal display panels by theartificial intelligence.

Two of the leading vehicles reduce their alert value for external smokedetection and one declares a value of zero. The artificial intelligencerecognizes the changing pattern of the alert value and shifts itsprocessing power (the heavier concentration of its conscripted microgrid processors) further back amongst the following vehicles.

Eventually all micro grid alert values are zero and the artificialintelligence decays leaving twelve vehicles travelling on the freewaywith larger vehicle gaps between them and moving at 45 miles per hour.The drivers all gradually increase their speed again to fifty miles perhour. Cloud computing has been efficient and the micro grids wereeffective.

C. Micro Grid Power

FIG. 15 is a block diagram depicting a micro grid computing system 3050with a bridge module 2010 physically connecting a micro grid processorapparatus 1320 to a power hub apparatus 3000, in accordance withembodiments of the present invention. The bridge module 2010 comprisesbridge units 2011 and 2012 connected together by a bridge hinge 2035.The bridge hinge 2035 provides the bridge module 2010 with sufficientphysical flexibility to enable the bridge units 2011 and 2012 to dockand be ensconced into respective docking bays of the micro gridprocessor apparatus 1320 and the power hub apparatus 3000. Generally,the micro grid processor apparatus 1320 and the power hub apparatus 3000are embodiments of a first micro grid system and a second micro gridsystem, respectively.

The micro grid processor apparatus 1320 comprises two sets of nineprocessors (cell processors) (65), attached to four types of add-onirregular shaped modular system devices (200, 420, 410, 415), andconnection to the bridge module 2010, linking the micro grid processorapparatus 1320 to a micro grid battery pack or power hub apparatus 3000containing an assembly of rechargeable batteries (not shown) and fivedocking bays each capable of accommodating a stack of three irregularmodular system devices, each with a bus connection 55. Attached to themicro grid power hub apparatus 3000 are a failsafe battery (3100),communications module (425), micro grid processor module (3220), andmicro grid processor module (3210). A failsafe battery is defined as abattery that has a probability of failure below a specified thresholdprobability by including features in the battery that automaticallycounteract anticipated sources of failure of the battery (e.g., viacontinuous monitoring of battery voltage and/or charge).

Thus, a micro grid apparatus in a bridge structure may be a micro gridprocessor apparatus (“processor apparatus” for short) or a micro gridpower hub apparatus (“power hub apparatus” or“power hub” for short). Aprocessor apparatus (e.g., processor apparatus 1320) is defined as amicro grid apparatus whose central area 115 comprises a plurality ofmicro grid processors 65 that includes a unique processor 60. A powerhub apparatus (e.g., power hub apparatus 3000) is defined as a microgrid apparatus whose central area 125 comprises a plurality ofrechargeable batteries.

The micro grid power hub apparatus 3000 has docking bay accommodationfor fifteen add-on irregular modular system devices in one embodiment ofthe present invention.

A functional purpose of the features for the fixed, mobile, or remotemicro grid computing system (3050) is to provide:

-   -   1. a battery power device (power hub apparatus 3000) for a        fixed, mobile or remote micro grid system embodied in a single        complex apparatus;    -   2. a hub of docking bays for attaching a plurality of irregular        shaped modules to a fixed, mobile or remote micro grid system        embodied in a single complex apparatus;    -   3. a failsafe battery contained within an irregular shaped        module (3100) for maintaining localized data vitality of random        access memory and processor cache memory in the event of a main        supply power failure to small fixed micro grid systems, and        other micro grid systems that do not have access to, wherein the        failsafe battery irregular shaped module structure 3100 is able        to connect to any available docking bay on either a complex        shaped micro grid apparatus (1310) or another micro grid power        hub apparatus (3000);    -   4. an add-on micro grid of nine cell processors contained within        an irregular shaped module (3210) for increasing the number of        processors in a micro grid within the embodiment of a single        apparatus;    -   5. an add-on micro grid of eighteen cell processors contained        within an irregular shaped module (3220) for increasing the        number of processors in a micro grid within the embodiment of a        single apparatus;    -   6. a complex shaped structure for the containment of a primary        12 Volt (5 Amp Hour) battery for a constant source of supply of        micro grid voltage and power (power hub apparatus 3000).

FIG. 16A is a diagram of a micro grid bridge structure 3300, which is abridge structure connecting a micro grid processor apparatus 1310 to amicro grid power hub apparatus 3000 by a micro grid bridge module 2010,in accordance with embodiments of the present invention. The micro gridprocessor apparatus 1310 comprises four irregular shaped modules (200,420, 410, 415). The power hub apparatus 3000 comprises three failsafebattery modules 3100, one irregular shaped module (425), and tenavailable docking bays.

A functional purpose of the physical micro grid structure 3300 for afixed, mobile or remote micro grid computing system is to provide amicro grid system with:

-   -   1. one terabyte of memory (200) in one embodiment;    -   2. Global Positioning data (420) in one embodiment;    -   3. Input and Output for mouse, keyboard, pointing devices and        digital monitor (410) in one embodiment;    -   4. mesh wireless for cloud computing micro grid communication        (415), (i.e., macro grid artificial intelligence communication)        in one embodiment;    -   5. additional micro grid module access by a bridge module        (2010), containing micro grid system buses, power and        maintenance serviceability in one embodiment;    -   6. Ethernet fibre optic and 802.11g Wireless (Transmission        Control Protocol/Internet Protocol) Communications (425) for the        unique processor alert detection, alert scale communication and        adjacent apparatus micro grid processor availability        recognition;    -   7. a primary battery power supply or power hub apparatus (3000),        attached to the filtered mains power supply (or a solar panel in        some mobile and remote locations), with a voltage light emitting        diode indicator (3110) to indicate charge condition;    -   8. failsafe battery (3100) for short term memory vitality, with        a voltage light emitting diode indicator (3105) to indicate        charge condition;    -   9. ten additional docking bays, for additional micro grid        modules and failsafe battery recharging, are available on the        upper two layers of the power hub apparatus (3000).

FIG. 16B is a diagram of a micro grid bridge structure (3400), which isa bridge structure showing a micro grid processor apparatus (1310)connected by a first micro grid bridge module (2010A) to a first microgrid power hub apparatus (3000A) and by a second micro grid bridgemodule (2010B) to a second micro grid power hub apparatus (3000B), inaccordance with an embodiments of the present invention. The micro gridbridge structure (3400) includes eleven irregular shaped modules, namelytwo irregular shaped modules 200, two irregular shaped modules 425, twoirregular shaped modules 410, one irregular shaped module 415, oneirregular shaped module 420, and three failsafe battery modules 3100.FIG. 16B shows two dotted lines, one from point E to point F, and onefrom point G to point H that are described infra in conjunction withFIG. 16D and FIG. 16F, respectively.

The micro grid bridge structure (3400) may be used for bus expansion,micro grid scalability, increased battery power, and additional dockingbays for a fixed, mobile or remote micro grid computing system.Additional features to the micro grid bridge structure (3400) include:micro grid expandability, scalability and battery power doubling, by useof two bridged complex shaped power hubs, and additional unfilleddocking bays available for additional micro grid irregular shapedmodules to be added.

The failsafe battery's voltage light emitting diode indicator (3105),and the power hub apparatus's voltage light emitting diode indicator(3110), indicate the voltage charge status of the failsafe battery andthe power hub apparatus, respectively, by a green, yellow or red(tri-state light emitting diode) condition.

In one embodiment, the light emitting diode indicator (3105) in thefailsafe battery irregular shaped module (3100) includes a tri-statelight emitting diode Power status indicator.

In one embodiment, the light emitting diode indicator (3110) in thepower hub apparatus (3000) includes a tri-state light emitting diodePower status indicator.

The failsafe battery irregular shaped module and the power hub apparatusmay each include its own unique screen printed marking for uniquelyidentifying the failsafe battery and the power hub, and may each beindicative of the manufacturing source, and other descriptiveinformation such as date of manufacture, revision level of the internalelectronic content, etc. A unique bold identification icon may beembossed into the body (e.g., plastic or ceramic body) at the time thefailsafe battery and power hub is formed during manufacture.

The light emitting diodes (visual and infra red) on the two micro gridbridge structures (2010) are available for visually observing thevitality and data activity on the connected busses, and infra redmonitoring of the data buses by maintenance tools and in some mobile andremote locations, by robots.

FIG. 16C is a vertical section diagram (3500) showing part of one microgrid processor apparatus (1310) connected by a micro grid bridge module(2010) to the bottom docking bay of part of a micro grid power hubapparatus (3000), and two steps of assembling irregular shaped modules(3210) and (200) into the remaining docking bay connection points (305)of a micro grid power hub apparatus (3000) structure, in accordance withan embodiments of the present invention.

The assembling of irregular shaped modules (3210) and (200) into theremaining docking bay connection points (305) is shown in FIG. 16C for afixed, mobile or remote micro grid computing system in two steps (1 and2). Initially, the micro grid bridge structure (2010) is latched intoposition by the protrusion (320), on both sides and both halves of thebridge, fitting into receptors of the same size located on the insideradial arms of the micro grid power hub apparatus (3000) and micro gridprocessor complex shape (1310). Power and bus connection is made at the‘V’ shaped edge between the connection point of the bridge (310) and themicro grid power hub's connection point (305).

Similarly, the Random Access Memory irregular shaped module (200) isinserted and latches down in tier one of the micro grid power hub'sdocking bay.

A nine processor micro grid irregular shaped module (3210) latches downin tier two of the micro grid power hub's docking bay, with itsprotrusion (320) along latching edge 311 fitting into the two receptorsof the same size located on tier two of the inside radial arms of themicro grid power hub apparatus.

FIG. 16D is a vertical cross-sectional view (3550) along a line E-Fdepicted in FIG. 16B, showing the completed assembly process of thispart of the micro grid bridge structure (3400), in accordance with anembodiments of the present invention. According to the assembly stepstaken in the vertical section diagram in FIG. 16C, the result is a microgrid processor apparatus (1310) connected by a micro grid bridge module(2010B) to the bottom docking bay (tier zero) of a micro grid power hubapparatus (3000B), and two irregular shaped modules (3210), and (200),latched into the remaining vertical tier docking bay connection pointsof a micro grid power hub apparatus (3000B).

A power socket (3610) is provided on the center of one of the radialarms of the micro grid power hub apparatus (3000B) for battery chargingand filtered mains power supply connection, including electricalconnection to a solar panel charging ‘skin’ (3905) as described infra inconjunction with FIG. 22A.

FIG. 16E is a vertical section diagram (3600) showing part of one microgrid power hub apparatus (3000) connected by a micro grid bridge module(2010) to the bottom docking bay (tier zero) of part of another microgrid power hub apparatus (3000), and two stages of assembling irregularshaped modules (3220, 200, 200, 200), into the remaining docking bayconnection points (305) of both micro grid power hub apparatuses (3000),in accordance with embodiments of the present invention.

The assembling of irregular shaped modules (3220, 200, 200, 200) intothe remaining docking bay connection points (305) is shown in FIG. 16Efor a fixed, mobile or remote micro grid computing system in two steps(1 and 2). Initially the micro grid bridge structure (2010) is latchedinto position by the protrusion (320), on both sides and both halves ofthe bridge, fitting into receptors of the same size located on theinside radial arms of the micro grid power hubs (3000, 3000). Power andbus connection is made at the ‘V’ shaped edge between the connectionpoint of the bridge (310) and the micro grid power hub's connectionpoint (305).

Similarly, the three Random Access Memory irregular shaped modules (200,200, 200), shown, are inserted and latched down in the availablevertical tiers of the docking bay of the micro grid power hubs.

An eighteen processor micro grid irregular shaped module (3220) latchesdown in the tier two of the micro grid power hub's docking bay, with itsprotrusion (320) fitting into the two receptors of the same size locatedon tier two of the inside radial arms of the micro grid power hub.

FIG. 16F is a vertical cross-sectional view (3650) along a line G-Hdepicted in FIG. 16B, showing the completed assembly process of thispart of the micro grid bridge structure (3400), in accordance with anembodiments of the present invention. According to the assembly stepstaken in the vertical section diagram in FIG. 16E, the result is microgrid power hub apparatus (3000A), connected by a micro grid bridgemodule (2010A) to the bottom docking bay (tier zero) of micro gridprocessor apparatus (1310), and four irregular shaped modules (3220,200, 200, 200) are latched into the remaining vertical tier docking bayconnection points of micro grid power hub apparatus (3000A) and microgrid power hub apparatus (3000B).

A power socket (3610) is provided on the center of one of the radialarms of micro grid power hub apparatus (3000A) for battery charging andfiltered mains power supply connection, including electrical connectionto a solar panel charging ‘skin’ (3905) as described infra inconjunction with FIG. 22A.

FIG. 17 is a diagram (3700) showing the physical dimensionalmeasurements of the micro grid apparatus (1310) and irregular shapedmodules (200), in accordance with embodiments of the present invention.

The outer circular geometry (3701) of micro grid apparatus (1310) forcontainment of both nine and eighteen processors, and the outer circulargeometry of the complex shape for the micro grid power hub apparatus(3000), are the same. In one embodiment, the diameter (3702) and radius(3703) of the physical circle of the outer circular geometry (3701) are10 cm and 5 cm, respectively.

The irregular shaped module (200) fits snugly between the radial arms ofthe micro grid apparatus (1310) and is ensconced with less than 1 mm ofgap along the edges of the radial arms, the outer curved edge of theirregular shaped module (200) matches to the geometry of the outercircle (3701).

The inner and underlying pentagon geometry (3704) of all the micro gridcomplex shapes, including the shape of the micro grid apparatus (1310)for containment of both nine and eighteen processors, and the inner andunderlying geometry of the micro grid power hub apparatus (3000), arethe same.

The position of the center of the inner and outer pentagons (3704), and(3707), respectively (located as the intersection of any two lines from‘the centre of a base to the vertical apex’), and the position of thecenter of the outer physical circle of the outer circular geometry(3701), are the same. In one embodiment, the dimension of the innerpentagon (3704), namely pentagon base to apex length (3705), is 4.4 cm.In one embodiment, the dimension of the outer pentagon (3707), namelypentagon base to apex length (3709), is 4.8 cm,

The radius (3703) is from the center of the circle and pentagon, throughthe five apexes of the pentagon creating the center lines of the complexshapes radial arms. In one embodiment, the width (3720) of the radialarms is 1.4 cm. In one embodiment, a radius (3706) of an inner circle(3708) is 4.2 cm. In one embodiment, the cord (3735) between the radialarms on the inner circle (3708) is 4.0 cm. In one embodiment, the cord(3710) between the radial arms on the outer circle (3701) is 3.5 cm. Inone embodiment, the longest straight side (3740) of the irregular shapedmodule is 2.2 cm. In one embodiment, the inner ‘V’ edge (3730) of theirregular shaped module is 1.2 cm. In one embodiment, the outer ‘V’ edge(3725) of the irregular shaped module is 1.4 cm.

In summary, the geometric sizes in one embodiment are:

-   -   3702=10 cm; 3703=5.0 cm; 3705=4.4 cm; 3709=4.8 cm; 3720=1.4 cm;        3706=4.2; cm; 3735=4.0 cm; 3710=3.5 cm; 3740=2.2 cm; 3730=1.2        cm; 3725=1.4 cm.

FIG. 18A is a diagram showing the physical characteristics of a microgrid Random Access Memory (RAM) irregular shaped module (200), accordingto an embodiment of the present invention.

At least one terabyte of Random Access Memory (RAM) (200) is containedwithin an irregular shaped module structure.

A Random Access Memory irregular shaped module structure (200) is ableto connect to any available docking bay on either a shaped micro gridapparatus (1310) or a micro grid power hub apparatus (3000).

The protrusion (320) on each side of the irregular shaped RAM module(200) fits perfectly into the receptors of the same size located on bothinner sides of the radial arms of the micro grid ceramic apparatus(1310) and the micro grid power hub apparatus (3000).

In one embodiment, the longest straight side (210) of the irregularshaped module is 2.2 cm, and when ensconced it fits snugly against thesides of the radial arms with less than 1 mm of gap.

The ‘V’ shaped edge (310) provides the connection point for the microgrid bus, the macro grid bus, the system data buses, and the systempower supply.

The curved edge (3765) for the RAM irregular shaped module (200)contains no external connection points.

In one embodiment, the irregular shaped RAM module (200) includes atri-state light emitting diode Memory status indicator (3121).

The irregular shaped RAM module (200) may include its own unique screenprinted marking for uniquely identifying the irregular shaped RAM module(200) and may be indicative of the manufacturing source, and otherdescriptive information such as date of manufacture, revision level ofthe internal electronic content, etc. A unique bold identification iconmay be embossed into the body (e.g., plastic or ceramic body) at thetime the irregular shaped RAM module (200) is formed during manufacture.

FIG. 18B is a diagram showing the physical characteristics of a microgrid Input and Output (I/O) irregular shaped module (410), in accordancewith embodiments of the present invention.

This irregular shaped module structure is used for the containment ofthe electronic functionality and data buffers is necessary for Input andOutput (I/O) (410) of data to peripheral devices such as mouse,keyboard, pointing devices, and digital display, via three universalserial bus connectors on the outer curved edge (3760) of the irregularshaped Input/Output module.

An Input and Output (I/O) irregular shaped module structure (410) isable to connect to any available docking bay on either a micro gridapparatus (1310) or a micro grid power hub apparatus (3000).

The protrusion (320) on each side of the irregular shaped I/O module(410) fits perfectly into the receptors of the same size located on bothinner sides of the radial arms of the micro grid ceramic apparatus(1310) and the micro grid power hub apparatus (3000).

In one embodiment, the longest straight side (210) of the irregularshaped module is 2.2 cm, and when ensconced it fits snugly against thesides of the radial arms with less than 1 mm of gap.

The ‘V’ shaped edge (310) provides the connection point for the microgrid bus, the macro grid bus, the system data buses and the system powersupply.

The curved edge (3760) for the Input and Output (I/O) irregular shapedmodule (410) contains three universal serial bus external connectionpoints.

In one embodiment, the irregular shaped I/O module (410) includes threetri-state light emitting diode I/O status indicators (3122A, 3122B,3122C).

The irregular shaped I/O module (410) may include its own unique screenprinted marking for uniquely identifying the irregular shaped I/O module(410) and may be indicative of the manufacturing source, and otherdescriptive information such as date of manufacture, revision level ofthe internal electronic content, etc. A unique bold identification iconmay be embossed into the body (e.g., plastic or ceramic body) at thetime the irregular shaped I/O module (410) is formed during manufacture.

FIG. 18C is a diagram showing the physical characteristics of a microgrid 802.11s Mesh Wireless irregular shaped module (415), in accordancewith embodiments of the present invention.

This irregular shaped module structure, which is used for thecontainment of the electronic functionality of Mesh Wireless (Instituteof Electrical and Electronics Engineers 802.11s Mesh Wireless Standard)(415), is used for cloud computing communication of macro gridartificial intelligence to the assigned micro grid processors embodiedin each wirelessly connected apparatus.

A Mesh Wireless irregular shaped module structure (415) is able toconnect to any available docking bay on either a micro grid apparatus(1310) or a micro grid power hub apparatus (3000).

The protrusion (320) on each side of the irregular shaped Mesh Wirelessmodule (415) fits perfectly into the receptors of the same size locatedon both inner sides of the radial arms of the micro grid ceramicapparatus (1310) and the micro grid power hub apparatus (3000).

In one embodiment, the longest straight side (210) of the irregularshaped module is 2.2 cm, and when ensconced it fits snugly against thesides of the radial arms with less than 1 mm of gap.

The ‘V’ shaped edge (310) provides the connection point for the microgrid bus, the macro grid bus, the system data buses and the system powersupply.

The curved edge (3745) for the Mesh Wireless irregular shaped module(415) contains no external connection points.

In one embodiment, the Mesh Wireless irregular shaped module (415)includes a tri-state light emitting diode Mesh Wireless status indicator(3123).

The Mesh Wireless irregular shaped module (415) may include its ownunique screen printed marking for uniquely identifying the Mesh Wirelessirregular shaped module (415) and may be indicative of the manufacturingsource, and other descriptive information such as date of manufacture,revision level of the internal electronic content, etc. A unique boldidentification icon may be embossed into the body (e.g., plastic orceramic body) at the time the Mesh Wireless irregular shaped module(415) is formed during manufacture.

FIG. 18D is a diagram showing the physical characteristics of a microgrid Global Positioning System (GPS) irregular shaped module (420), inaccordance with embodiments of the present invention.

This irregular shaped module structure is used for the containment ofthe electronic functionality of a Global Positioning System (GPS) (420)and attachment to its external aerial, via a connector on the outercurved edge of the irregular shaped Global Positioning System module.

A Global Positioning System irregular shaped module structure (420) isable to connect to any available docking bay on either a shaped microgrid apparatus (1310) or a micro grid power hub apparatus (3000).

The protrusion (320) on each side of the irregular shaped Globalpositioning System module (420) fits perfectly into the receptors of thesame size located on both inner sides of the radial arms of the microgrid apparatus (1310) and the micro grid power hub apparatus (3000).

In one embodiment, the longest straight side (210) of the irregularshaped module is 2.2 cm, and when ensconced it fits snugly against thesides of the radial arms with less than 1 mm of gap.

The ‘V’ shaped edge (310) provides the connection point for the microgrid bus, the macro grid bus, the system data buses and the system powersupply.

The curved edge (3750) for the Global Positioning System's irregularshaped module (420) contains an external connection point for a GPSaerial.

In one embodiment, the GPS irregular shaped module (420) includes atri-state light emitting diode GPS status indicator (3124).

The GPS irregular shaped module (420) may include its own unique screenprinted marking for uniquely identifying the GPS irregular shaped module(420) and may be indicative of the manufacturing source, and otherdescriptive information such as date of manufacture, revision level ofthe internal electronic content, etc. A unique bold identification iconmay be embossed into the body (e.g., plastic or ceramic body) at thetime the GPS irregular shaped module (420) is formed during manufacture.

FIG. 18E is a diagram showing the physical characteristics of a microgrid Communications irregular shaped module (425), in accordance withembodiments of the present invention.

This irregular shaped module structure is used for the containment ofthe electronic functionality of Ethernet Communications, TransmissionControl Protocol (TCP) and Internet Protocol (IP) for connection toInternet Protocol devices and handsets, 802.11g Wireless (Institute ofElectrical and Electronics Engineers 802.11g Wireless Standard) (425),via embedded wireless in the irregular shaped Communications modulestructure and via three fibre optic connectors on the outer curved edgeof the irregular shaped Communications module.

A Communications irregular shaped module structure (425) is able toconnect to any available docking bay on either a micro grid apparatus(1310), or a micro grid power hub apparatus (3000), according to anembodiment of the present invention.

The protrusion (320) on each side of the irregular shaped Communicationsmodule (425) fits perfectly into the receptors of the same size locatedon both inner sides of the radial arms of the micro grid ceramicapparatus (1310) and the micro grid power hub apparatus (3000).

In one embodiment, the longest straight side (210) of the irregularshaped module is 2.2 cm, and when ensconced it fits snugly against thesides of the radial arms with less than 1 mm of gap.

The ‘V’ shaped edge (310) provides the connection point for the microgrid bus, the macro grid bus, the system data buses and the system powersupply.

The curved edge (3755) for the Communication irregular shaped module(425) contains three external TCP/IP fibre optic connection points.

In one embodiment, the Communications irregular shaped module (425)includes three tri-state light emitting diode Fibre Communication statusindicators (3125A, 3125B, 3125C).

The Communications irregular shaped module (425) may include its ownunique screen printed marking for uniquely identifying theCommunications irregular shaped module (425) and may be indicative ofthe manufacturing source, and other descriptive information such as dateof manufacture, revision level of the internal electronic content, etc.A unique bold identification icon may be embossed into the body (e.g.,plastic or ceramic body) at the time the Communications irregular shapedmodule (425) is formed during manufacture.

FIG. 18F is a diagram showing the physical characteristics of a microgrid Failsafe Battery irregular shaped module (3100), in accordance withembodiments of the present invention.

This irregular shaped module structure is used for the containment of afailsafe battery (3100).

A failsafe battery is provided within an irregular shaped module formaintaining localized data vitality of the micro grid random accessmemory (200) and the individual micro grid processor cache memory (notshown) in the event of a filtered mains power supply failure, or powerhub unavailability.

A failsafe battery irregular shaped module (3100) is able to connect toany available docking bay on either a micro grid apparatus (1310) ormicro grid power hub apparatus (3000).

The protrusion (320) on each side of the irregular shaped failsafebattery module (3100) fits perfectly into the receptors of the same sizelocated on both inner sides of the radial arms of the micro grid ceramicprocessor shape (1310) and the micro grid power hub apparatus (3000).

In one embodiment, the longest straight side (210) of the irregularshaped module is 2.2 cm, and when ensconced it fits snugly against thesides of the radial arms with less than 1 mm of gap.

The ‘V’ shaped edge (310) provides the connection point for the microgrid bus, the macro grid bus, the system data buses and the system powersupply.

The curved edge (3770) for the failsafe battery's irregular shapedmodule (3100) contains no external connection points

FIG. 18G is a diagram showing the physical characteristics of a NineCell processor micro grid add-on irregular shaped processor module(3210), in accordance with embodiments of the present invention.

This irregular shaped processor module structure is used for thecontainment of nine cell processors (3211) arranged internally as amicro grid system, with its own unique processor.

A nine processor irregular shaped module structure (3210) is able toconnect to any available docking bay on either a micro grid apparatus(1310) or a micro grid power hub apparatus (3000).

The protrusion (320) on each side of the nine processor irregular shapedmodule structure (3210) fits perfectly into the receptors of the samesize located on both inner sides of the radial arms of the micro gridceramic processor shape (1310) and the micro grid power hub apparatus(3000).

In one embodiment, the longest straight side (210) of the irregularshaped module is 2.2 cm, and when ensconced it fits snugly against thesides of the radial arms with less than 1 mm of gap.

The ‘V’ shaped edge (310) provides the connection point for the microgrid bus, the macro grid bus, the system data buses and the system powersupply.

The curved edge (3775) for the nine processor irregular shaped modulestructure (3210) contains no external connection points.

In one embodiment, the Nine Cell processor irregular shaped module(3210) includes a tri-state light emitting Processor Utilization statusindicator (3127).

The Nine Cell processor micro grid irregular shaped module (3210) mayinclude its own unique screen printed marking for uniquely identifyingthe Nine Cell processor micro grid irregular shaped module (3210) andmay be indicative of the manufacturing source, and other descriptiveinformation such as date of manufacture, revision level of the internalelectronic content, etc. A unique bold identification icon may beembossed into the body (e.g., plastic or ceramic body) at the time theNine Cell processor micro grid irregular shaped module (3210) is formedduring manufacture.

FIG. 18H is a diagram showing the physical characteristics of anEighteen Cell Processor micro grid add-on irregular shaped module(3220), in accordance with embodiments of the present invention.

This irregular shaped module structure is used for the containment ofeighteen cell processors (3221) arranged internally as a micro gridsystem, with its own unique processor (60).

An eighteen processor irregular shaped module structure (3220) is ableto connect to any available docking bay on either a micro grid apparatus(1310), or a micro grid power hub apparatus (3000).

The protrusion (320) on each side of the eighteen processor irregularshaped module structure (3220) fits perfectly into the receptors of thesame size located on both inner sides of the radial arms of the microgrid ceramic processor shape (1310) and the micro grid power hubapparatus (3000).

In one embodiment, the longest straight side (210) of the irregularshaped module is 2.2 cm, and when ensconced it fits snugly against thesides of the radial arms with less than 1 mm of gap.

The ‘V’ shaped edge (310) provides the connection point for the microgrid bus, the macro grid bus, the system data buses and the system powersupply.

The curved edge (3780) for the eighteen processor irregular shapedmodule structure (3220) contains no external connection points.

When an irregular shaped module containing processors is added to afunctional micro grid system processor stack, by connecting it via anavailable docking bay, it increases the number of unique processorsembodied in the micro grid apparatus by one.

In one embodiment, the Eighteen Cell processor irregular shaped module(3220) includes a tri-state light emitting Processor Utilization statusindicator (3128).

The Eighteen Cell processor micro grid irregular shaped module (3220)may include its own unique screen printed marking for uniquelyidentifying the Eighteen Cell processor micro grid irregular shapedmodule (3220) and may be indicative of the manufacturing source, andother descriptive information such as date of manufacture, revisionlevel of the internal electronic content, etc. A unique boldidentification icon may be embossed into the body (e.g., plastic orceramic body) at the time the Eighteen Cell processor micro gridirregular shaped module (3220) is formed during manufacture.

FIG. 19A is a diagram showing physical characteristics of a micro gridpower hub apparatus (3000), in accordance with embodiments of thepresent invention. The micro grid power hub apparatus (3000) is used forthe containment of a primary 12 Volt (5 Amp Hour) battery for a constantsource of supply of micro grid voltage and power (3000) and theprovisioning of fifteen docking bays to accommodate irregular shapedmodules with data bus connection and physical attachment, forselectively designing a complete functional micro grid apparatus.

Other than profile height (3615), this micro grid power hub apparatus(3000) has the same physical plan layout and manufacturing tolerances asthe micro grid ceramic chip apparatus (1310).

The profile height (3615), of 3.5 cm, in one embodiment, provides forthree tiers in each docking bay (i.e., 15 connection locations (305) forirregular shaped modules compared with 5 connection locations (305)available on the micro grid ceramic chip apparatus (1310)).

This primary battery power supply or power hub apparatus (3000) isattached to the filtered mains power supply (or a solar panel in somemobile and remote locations), and has a Voltage Light Emitting Diode(LED) indicator (3110) to indicate the power hub's charge condition.

Additional taller micro grid power hubs (i.e. ‘power hub towers’) can bemanufactured to further increase the number of docking bays available(and increase the available electrical power), enabling the multiplestacking of micro grid apparatuses, each connected by a bridge module toa central micro grid power hub tower.

FIG. 19B is a vertical cross-sectional view (3810) along a line I-Jdepicted in FIG. 19A, showing physical characteristics of a micro gridpower hub apparatus (3000), in accordance with embodiments of thepresent invention.

The micro grid power hub's profile height (3615), of 3.5 cm in oneembodiment, provides for three tiers in each docking bay (i.e., 15connection locations (305) for irregular shaped modules in 5 dockingbays on the micro grid ceramic apparatus (1310)).

A power socket or receptacle (3610) is provided on the center of one ofthe radial arms of the micro grid power hub apparatus (3000) for batterycharging and filtered mains power supply connection, includingelectrical connection to a solar panel charging ‘skin’ (3905) asdescribed infra in conjunction with FIG. 22A.

FIG. 20 is a diagram (3820) showing electrical power and data busdistribution and characteristics of a micro grid power hub apparatus(3000), in accordance with embodiments of the present invention.

The micro grid power hub apparatus (3000) provides battery power (3825)and also a composite bus 1720, which includes the micro grid system bus1205, the standard system bus (1210, 1215), and the macro grid systembus 1220, for each of the three tiers in each docking bay (i.e., 15connection locations for irregular shaped modules).

A power socket (3610) is provided on the center of one of the radialarms of the micro grid power hub apparatus (3000) for either batterycharging from a filtered mains power supply connection or electricalconnection to a solar panel charging ‘skin’ (3905) as described infra inconjunction with FIG. 22A.

FIG. 21A is a vertical section diagram (3830) showing a micro grid powerhub apparatus (3000) as a single apparatus, in accordance withembodiments of the present invention.

A power socket (3610) is provided on the center of one of the radialarms of the micro grid power hub apparatus (3000) for either batterycharging from a filtered mains power supply connection, or electricalconnection to a solar panel charging ‘skin’ (3905) as described infra inconjunction with FIG. 22A.

The vertical section diagram (3830) shows three irregular modulesattached, a eighteen processor micro grid irregular shaped module(3220), and two terabytes of random access memory (200, 200), latcheddown in the connected position.

FIG. 21B is a vertical section diagram (3840) showing a micro grid powerhub apparatus (3000) and bridge module (2010) connected to a micro gridprocessor ceramic chip apparatus (1310) as part of a larger apparatus,in accordance with embodiments of the present invention.

A power socket (3610) is provided on the center of one of the radialarms of the micro grid power hub apparatus (3000) for either batterycharging from a filtered mains power supply connection, or electricalconnection to a solar panel charging ‘skin’ (3905) as described infra inconjunction with FIG. 22A.

The vertical section diagram (3840) shows two terabytes of random accessmemory (200, 200), latched down in the connected position, in tier twoand tier one positions, and a connected micro grid bridge latched downin the tier zero position.

FIG. 22A is a diagram (3900) showing physical characteristics of acircular shaped micro grid ‘solar power skin’ structure (3905),according to an embodiment of the present invention.

In one embodiment, the micro grid solar power skin (3905) has aninternal diameter (3920) of 10 cm. to fit over the micro grid power hubapparatus (3000), and an external diameter (3925) of 10.5 cm. to coverand latch down over the micro grid power hub apparatus (3000).

In one embodiment, the solar panel is arranged as a moulded composite ofone central and five surrounding polygonal shapes, with a connectioncable (3910) and power plug (3915) provided to attach to the powersocket (3610) on the micro grid power hub's radial arm outer side totransmit power from the micro grid solar power skin (3905) to the microgrid power hub apparatus (3000).

This micro grid solar power skin (3905) extracts available solar energyfrom the sun's electromagnetic radiation field, which may be used torecharge or power the batteries in the micro grid power hub apparatus(3000) for some fixed, some mobile, and some remote locations wherenormal mains power supplies are unavailable and cloud computing isrequired to operate.

Thus, the solar power skin covers a power hub apparatus, wherein aninternal portion of the solar power skin fits over the power hubapparatus and an outer portion of the solar power skin covers andlatches down over the first power hub apparatus. The solar power skinextracts available solar energy from the sun's electromagnetic radiationfield and is electrically connected to the power hub apparatus torecharge or power the rechargeable batteries in the power hub apparatus.

The micro grid solar power skin (3905) may comprise any material knownin the art as being capable of extracting available solar energy fromthe sun's electromagnetic radiation field for storage and subsequentusage. In one embodiment, the micro grid solar power skin (3905) maycomprise a material comprising copper, indium, gallium, and selenite(CIGS).

FIG. 22B is a vertical cross-sectional view (3930) along a line L-Mdepicted in FIG. 22A, showing a micro grid power hub apparatus (3000),and the assembly of a circular shaped micro grid ‘solar power skin’structure (3905), in accordance with embodiments of the presentinvention.

The solar power skin (3905) for the micro grid power hub apparatus(3000) is lowered and latched into place around the edge (3935) of thepower skin (3905).

A power plug (3915) attached to the solar power skin (3905) ispositioned to be inserted into the power socket or receptacle (3610) onthe end of a radial arm of the micro grid power hub apparatus (3000).

Three latched down irregular shaped modules are shown in the verticalcross-sectional view (3930), including a random access module (200) intier zero position.

FIG. 22C is a vertical cross-sectional view (3940) along a line I-Jdepicted in FIG. 22A, showing a micro grid power hub apparatus (3000)assembled with a circular shaped micro grid ‘solar power skin’ structure(3905), in accordance with embodiments of the present invention.

The solar power skin (3905) for the micro grid power hub apparatus(3000) is positioned and latched into place around the edge 3935.

The power plug (3915) attached to the solar power skin (3905) isinserted into the power socket or receptacle (3610) on the end of aradial arm of the micro grid power hub apparatus (3000).

A micro grid apparatus containing a plurality of micro grid power hubapparatuses (3000) may have a plurality of micro grid solar power skinstructures (3905) to sufficiently recharge and maintain battery powerfor some fixed, some mobile, and some remote locations where cloudcomputing is used.

FIG. 23 is a diagram of a micro grid apparatus 100 in which irregularshaped modules 200, 410, 415, 420, and 425, which may contain chipstructures, are fitted into all available docking bays, in accordancewith embodiments of the present invention. Diagrammatic arrows 460illustrate where the irregular shaped modules fit to complete the fullyassembled micro grid apparatus 100. A flowchart describing the assemblyof the micro grid apparatus is provided in FIG. 24, described infra. Amanufactured mark 430 on the top surface of the appropriate radial armindicates the position of connection pin 1 for ease of manufacturing anddevice replacement. FIG. 4B depicts the completed assembly of the microgrid apparatus of FIG. 23.

FIG. 24 is a flow chart describing a process for assembling a micro gridapparatus (e.g., the micro grid apparatus 500 in FIG. 4B), in accordancewith embodiments of the present invention. The flowchart of FIG. 24comprises steps 711-716.

Step 711 selects a micro grid apparatus 100 (see FIG. 23) having acomplex shape. In one embodiment, the micro grid apparatus represents acentral processing unit. The manufactured mark 430 (see FIG. 23) on aradial arm of the micro grid apparatus 100 may be used to locate pinone.

Step 712 places the micro grid apparatus 100 with its complex shape onthe circuit board, using multi-pin containment connection carriagessoldered in place, said manufactured mark 430 ensuring that pin one isin the correct position. The multi-pin containment connection carriagesare designed with a release mechanism to enable the removal of thecomplex shape, if necessary, from its physical connection to themountable multi-layered printed circuit board.

Step 713 selects irregular shaped modules to be fitted into respectivedocking bays of the micro grid apparatus 100. In one embodiment, thetotal number of irregular shaped modules to be fitted into respectivedocking bays of the micro grid apparatus 100 is equal to the totalnumber of empty docking bays of the micro grid apparatus 100. In oneembodiment, the total number of irregular shaped modules to be fittedinto respective docking bays of the micro grid apparatus 100 is lessthan the total number of empty docking bays of the micro grid apparatus100. In one embodiment, the respective docking bays are randomlyselected for being fitted into by the selected irregular shaped modules.In one embodiment, docking bays specific to each selected irregularshaped module are selected for being fitted into by the selectedirregular shaped modules.

Step 714 fits an irregular shaped module into a docking bay of the microgrid apparatus 100 (i.e., the complex shape). The multiple serial busconfigured edge of the irregular shaped module is fitted into one of thefive electrical connection points on the complex structure's wedgeshaped ‘V’ edge, by pressing down on the outer curved edge of theirregular shaped module until the device edge(s) latch into place in thedocking bay.

Step 715 determines whether all irregular shaped modules have beenfitted into the docking bay. If Step 715 determines that all irregularshaped modules have not been fitted into the docking bay then theprocess loops back to step 714 to fit the next irregular shaped moduleinto the docking bay; otherwise all docking bays of the complex shapeare occupied with irregular shaped modules to form the assembled microgrid apparatus 100 (which has the appearance of, for example, the microgrid apparatus 500 of FIG. 4B with the fitted irregular shaped modules),and step 716 is next performed.

Step 716 performs mechanical assembly quality control tests beforequality assurance approval of the assembled apparatus occurs. Then themechanical assembly process of FIG. 7 is complete and ends.

FIG. 25 is a flow describing a process for assembling a micro gridbridge structure, in accordance with embodiments of the presentinvention. The flowchart of FIG. 24 comprises steps 811-813

Step 811 provides a plurality of micro grid apparatuses. Each micro gridapparatus comprising a central area and radial arms integrally connectedto and extending radially outward from the central area such that eachpair of adjacent radial arms defines a docking bay into which anirregular shaped module may be latched. Each micro grid apparatus iseither a power hub apparatus whose central area comprises a plurality ofrechargeable batteries or a processor apparatus whose central areacomprises a plurality of processors that includes a unique processorhaving a unique operating system differing from an operating system ineach other processor of the plurality of processors.

Step 812 provides at least one bridge module comprising two bridge unitsconnected by a bridge hinge.

Step 813 latches each bridge unit in each bridge module of the at leastone bridge module into a docking bay of a respective micro gridapparatus of two grid micro apparatuses of the plurality of micro gridapparatuses to bridge the two grid apparatuses together, which resultsin each micro grid apparatus being bridged to at least one other microgrid apparatus of the plurality of micro grid apparatuses. A micro gridbridge structure results from performance of the process described inthe flow chart of FIG. 25. The micro grid bridge structure comprises aplurality of micro grid apparatuses and at least one bridge module. Eachbridge module comprises two bridge units connected by a bridge hinge.Each micro grid apparatus comprises a central area and radial armsintegrally connected to and extending radially outward from the centralarea such that each pair of adjacent radial arms defines a docking bayinto which an irregular shaped module may be latched. Each bridge unitin each bridge module of the at least one bridge module is attached intoa docking bay of a respective micro grid apparatus of two micro gridapparatuses of the plurality of micro grid apparatuses to bridge the twogrid apparatuses together, wherein each micro grid apparatus is bridgedto at least one other micro grid apparatus of the plurality of microgrid apparatuses. Each micro grid apparatus is either a power hubapparatus whose central area comprises a plurality of rechargeablebatteries or a processor apparatus whose central area comprises aplurality of processors that includes a unique processor having a uniqueoperating system differing from an operating system in each otherprocessor of the plurality of processors.

D. Data Processing Apparatus

FIG. 26 illustrates an exemplary data processing apparatus 90 used forimplementing any process or functionality of any processor, apparatus,or structure used in accordance with embodiments of the presentinvention. The data processing apparatus 90 comprises a processor 91, aninput device 92 coupled to the processor 91, an output device 93 coupledto the processor 91, and memory devices 94 and 95 each coupled to theprocessor 91. The input device 92 may be, inter alia, a keyboard, amouse, etc. The output device 93 may be, inter alia, a printer, aplotter, a computer screen, a magnetic tape, a removable hard disk, afloppy disk, etc. The memory devices 94 and 95 may be, inter alia, ahard disk, a floppy disk, a magnetic tape, an optical storage such as acompact disc (CD) or a digital video disc (DVD), a dynamic random accessmemory (DRAM), a read-only memory (ROM), etc. The memory device 95includes a computer code 97 which is a computer program that comprisescomputer-executable instructions. The computer code 97 is program codethat includes an algorithm for implementing any process or functionalityof any processor, apparatus, or structure used in accordance withembodiments of the present invention. The processor 91 implements (i.e.,performs) the computer code 97. The memory device 94 includes input data96. The input data 96 includes input required by the computer code 97.The output device 93 displays output from the computer code 97. Eitheror both memory devices 94 and 95 (or one or more additional memorydevices not shown in FIG. 15) may be used as a computer usable storagemedium (or program storage device) having a computer readable programembodied therein and/or having other data stored therein, wherein thecomputer readable program comprises the computer code 97. Generally, acomputer program product (or, alternatively, an article of manufacture)of the computer system 90 may comprise said computer readable storagemedium (or said program storage device).

Any of the components of the present invention could be created,integrated, hosted, maintained, deployed, managed, serviced, supported,etc. by a service provider who offers to facilitate implementation ofany process or functionality of any processor, apparatus, or structureused in accordance with embodiments of the present invention. Thus thepresent invention discloses a process for deploying or integratingcomputing infrastructure, comprising integrating computer-readable codeinto the data processing apparatus 90. Therefore, the code incombination with the data processing apparatus 90 is capable ofperforming any process or functionality of any processor, apparatus, orstructure used in accordance with embodiments of the present invention.

In another embodiment, the invention provides a method that performs theprocess steps of the invention on a subscription, advertising, and/orfee basis. That is, a service provider, such as a Solution Integrator,could offer to facilitate implementation of any process or functionalityof any processor used in accordance with embodiments of the presentinvention. In this case, the service provider can create, integrate,host, maintain, deploy, manage, service, support, etc., a computerinfrastructure that performs the process steps of the invention for oneor more customers. In return, the service provider can receive paymentfrom the customer(s) under a subscription and/or fee agreement and/orthe service provider can receive payment from the sale of advertisingcontent to one or more third parties.

While FIG. 26 shows only one processor 91, the processor 91 mayrepresent an array of processors such as the plurality of processors 65coupled to the input device 92, the output device 93, and the memorydevices 94 and 95.

While FIG. 26 shows the data processing apparatus 90 as a particularconfiguration of hardware and software, any configuration of hardwareand software, as would be known to a person of ordinary skill in theart, may be utilized for the purposes stated supra in conjunction withthe particular data processing apparatus 90 of FIG. 26. For example, thememory devices 94 and 95 may be portions of a single memory devicerather than separate memory devices.

While particular embodiments of the present invention have beendescribed herein for purposes of illustration, many modifications andchanges will become apparent to those skilled in the art. Accordingly,the appended claims are intended to encompass all such modifications andchanges as fall within the true spirit and scope of this invention.

What is claimed is:
 1. A micro grid bridge structure, comprising: aplurality of micro grid apparatuses, each micro grid apparatuscomprising a central area and radial arms integrally connected to andextending radially outward from the central area such that each pair ofadjacent radial arms defines a docking bay into which an irregularshaped module is latched; at least one bridge module comprising twobridge units connected by a bridge hinge; each bridge unit in eachbridge module of the at least one bridge module being latched into adocking bay of a respective micro grid apparatus of two micro gridapparatuses of the plurality of micro grid apparatuses to bridge the twogrid apparatuses together such that each micro grid apparatus is bridgedto at least one other micro grid apparatus of the plurality of microgrid apparatuses; each micro grid apparatus being either a power hubapparatus whose central area comprises a plurality of rechargeablebatteries or a processor apparatus whose central area comprises aplurality of processors that includes a unique processor having a uniqueoperating system differing from an operating system in each otherprocessor of the plurality of processors.
 2. The micro grid bridgestructure of claim 1, wherein a first micro grid apparatus of theplurality of micro grid apparatuses is a power hub apparatus, andwherein a first docking bay comprised by the first micro grid apparatusis a failsafe battery.
 3. The micro grid bridge structure of claim 1,wherein a first micro grid apparatus of the plurality of micro gridapparatuses is a first power hub apparatus, wherein a solar power skincovers the first power hub apparatus, wherein an internal portion of thesolar power skin fits over the first power hub apparatus and an outerportion of the solar power skin covers and latches down over the firstpower hub apparatus, and wherein the solar power skin extracts availablesolar energy from the sun's electromagnetic radiation field and iselectrically connected to the power hub apparatus to recharge or powerthe rechargeable batteries in the first power hub apparatus.
 4. Themicro grid bridge structure of claim 1, wherein the plurality of microgrid apparatuses comprises a first micro grid apparatus, a second microgrid apparatus, and a third micro grid apparatus, wherein the pluralityof bridge modules comprises a first bridge module and a second bridgemodule, wherein a first bridge unit and a second bridge unit of thefirst bridge module is respectively latched into a first docking bay ofthe second micro grid apparatus and a docking bay of the first microgrid apparatus, and wherein a first bridge unit and a second bridge unitof the second bridge module is respectively latched into a seconddocking bay of the second micro grid apparatus and a docking bay of thethird micro grid apparatus.
 5. The micro grid bridge structure of claim4, wherein the first micro grid apparatus is a first processorapparatus, wherein the second micro grid apparatus is a second processorapparatus, and wherein the third micro grid apparatus is a thirdprocessor apparatus.
 6. The micro grid bridge structure of claim 4,wherein the first micro grid apparatus is a first power hub apparatus,wherein the second micro grid apparatus is a first processor apparatus,and wherein the third micro grid apparatus is a second power hubapparatus.
 7. The micro grid bridge structure of claim 1, wherein theplurality of micro grid apparatuses consists of N micro grid apparatuses(A₁, A₂, . . . , A_(N1)) in a closed ring formation such that N is atleast 3, and wherein the N micro grid apparatuses are bridged togetherin the sequence of: A₁, A₂, . . . , A_(N), A₁.
 8. The micro grid bridgestructure of claim 1, wherein the micro grid bridge structure comprisesM centric bridge structures such that M is at least 1, wherein eachcentric bridge structure comprises a central micro grid apparatus, Nouter micro grid apparatuses such that N is at least 2, and N bridgemodules, wherein each bridge module of the N bridge modules comprises afirst bridge unit latched to a docking bay of the central micro gridapparatus and a second bridge unit latched to a docking bay of acorresponding micro grid apparatus of the N outer micro gridapparatuses; wherein the plurality of micro grid apparatuses comprisesthe central micro grid apparatus and the N outer micro grid apparatusesof the M centric bridge structures; wherein the at least one bridgemodule comprises a plurality of bridge modules that includes the Nbridge modules of the M centric bridge structures; and wherein if M>1,then each centric bridge structure of the M centric bridge structures isbridged by at least one other bridge module of the plurality of bridgemodules to a corresponding at least one other centric bridge structureof the M centric bridge structures.
 9. The micro grid bridge structureof claim 8, wherein M=1.
 10. The micro grid bridge structure of claim 8,wherein M>1.
 11. A method for forming a micro grid bridge structure,said method comprising: providing a plurality of micro grid apparatusesand at least one bridge module comprising two bridge units connected bya bridge hinge, each micro grid apparatus comprising a central area andradial arms integrally connected to and extending radially outward fromthe central area such that each pair of adjacent radial arms defines adocking bay into which an irregular shaped module may be latched;latching each bridge unit in each bridge module of the at least onebridge module into a docking bay of a respective micro grid apparatus oftwo grid micro apparatuses of the plurality of micro grid apparatuses tobridge the two grid apparatuses together, resulting in each micro gridapparatus being bridged to at least one other micro grid apparatus ofthe plurality of micro grid apparatuses, each micro grid apparatus beingeither a power hub apparatus whose central area comprises a plurality ofrechargeable batteries or a processor apparatus whose central areacomprises a plurality of processors that includes a unique processorhaving a unique operating system differing from an operating system ineach other processor of the plurality of processors.
 12. The micro gridbridge structure of claim 11, wherein a first micro grid apparatus ofthe plurality of micro grid apparatuses is a power hub apparatus, andwherein a first docking bay comprised by the first micro grid apparatusis a failsafe battery.
 13. The micro grid bridge structure of claim 11,wherein a first micro grid apparatus of the plurality of micro gridapparatuses is a first power hub apparatus, wherein the method furthercomprises: covering the first power hub apparatus with a solar powerskin, wherein an internal portion of the solar power skin fits over thefirst power hub apparatus and an outer portion of the solar power skincovers and latches down over the first power hub apparatus, and whereinthe solar power skin extracts available solar energy from the sun'selectromagnetic radiation field; and electrically connecting the solarpower skin to the power hub apparatus to recharge or power therechargeable batteries in the first power hub apparatus.
 14. The microgrid bridge structure of claim 11, wherein the plurality of micro gridapparatuses comprises a first micro grid apparatus, a second micro gridapparatus, and a third micro grid apparatus, wherein the plurality ofbridge modules comprises a first bridge module and a second bridgemodule, wherein a first bridge unit and a second bridge unit of thefirst bridge module is respectively latched into a first docking bay ofthe second micro grid apparatus and a docking bay of the first microgrid apparatus, and wherein a first bridge unit and a second bridge unitof the second bridge module is respectively latched into a seconddocking bay of the second micro grid apparatus and a docking bay of thethird micro grid apparatus.
 15. The micro grid bridge structure of claim14, wherein the first micro grid apparatus is a first processorapparatus, wherein the second micro grid apparatus is a second processorapparatus, and wherein the third micro grid apparatus is a thirdprocessor apparatus.
 16. The micro grid bridge structure of claim 14,wherein the first micro grid apparatus is a first power hub apparatus,wherein the second micro grid apparatus is a first processor apparatus,and wherein the third micro grid apparatus is a second power hubapparatus.
 17. The micro grid bridge structure of claim 11, wherein theplurality of micro grid apparatuses consists of N micro grid apparatuses(A₁, A₂, . . . , A_(N1)) in a closed ring formation such that N is atleast 3, and wherein the N micro grid apparatuses are bridged togetherin the sequence of: A₁, A₂, . . . , A_(N), A₁.
 18. The micro grid bridgestructure of claim 11, wherein the micro grid bridge structure comprisesM centric bridge structures such that M is at least 1, wherein eachcentric bridge structure comprises a central micro grid apparatus, Nouter micro grid apparatuses such that N is at least 2, and N bridgemodules, wherein each bridge module of the N bridge modules comprises afirst bridge unit latched to a docking bay of the central micro gridapparatus and a second bridge unit latched to a docking bay of acorresponding micro grid apparatus of the N outer micro gridapparatuses; wherein the plurality of micro grid apparatuses comprisesthe central micro grid apparatus and the N outer micro grid apparatusesof the M centric bridge structures; wherein the at least one bridgemodule comprises a plurality of bridge modules that includes the Nbridge modules of the M centric bridge structures; and wherein if M>1,then each centric bridge structure of the M centric bridge structures isbridged by at least one other bridge module of the plurality of bridgemodules to a corresponding at least one other centric bridge structureof the M centric bridge structures.
 19. The micro grid bridge structureof claim 18, wherein M=1.
 20. The micro grid bridge structure of claim18, wherein M>1.